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參數(shù)資料
| 型號： | ACPM-7881-TR1 |
| 廠商： | AGILENT TECHNOLOGIES INC |
| 元件分類： | 放大器 |
| 英文描述： | 1920 MHz - 1980 MHz RF/MICROWAVE NARROW BAND MEDIUM POWER AMPLIFIER |
| 封裝： | 4 X 4 MM, 1.10 MM HEIGHT, LEAD FREE, SMT, 10 PIN |
| 文件頁數(shù)： | 3/12頁 |
| 文件大?。?/td> | 221K |
| 代理商： | ACPM-7881-TR1 |
11
PCB Design Guidelines
The recommended ACPM-7881
PCB land pattern is shown in
Figure 16. The substrate is
coated with solder mask
between the I/O and
conductive paddle to protect
the gold pads from short
circuit that is caused by solder
bleeding / bridging.
Stencil Design Guidelines
A properly designed solder
screen or stencil is required to
ensure optimum amount of
solder paste is deposited onto
the PCB pads. The
recommended stencil layout is
shown in Figure 17. The
stencil has a solder paste
deposition opening that is
approximately 80% of the PCB
pad. Reducing the stencil
opening can potentially
generate more voids. On the
other hand, stencil openings
larger than 100% will lead to
excessive solder paste smear
or bridging across the I/O pads
or conductive paddle to
adjacent I/O pads. Considering
the fact that solder paste
thickness will directly affect
the quality of the solder joint,
a good choice is to use laser
cut stencil composed of
0.100mm (4 mils) or 0.127mm
(5 mils) thick stainless steel
which is capable of producing
the required fine stencil
outline. The combined PCB
and stencil layout is shown in
Figure 18.
Figure 16. PCB land pattern (dimensions in mm)
Figure 17. Stencil outline drawing (dimensions in mm)
Figure 18. Combined PCB and stencil layouts (dimensions in mm)
2.1
0.85
(PITCH)
0.375
0.55
3.9
0.3
0.55
0.375
1.68
0.44
0.64
0.44
0.85
3.12
0.41
2.1
1.68
3.9
0.55
Stencil
Opening
0.44
3.12
0.55
0.44
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相關(guān)代理商/技術(shù)參數(shù) |
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|---|---|
| ACPM-7886 | 制造商:AVAGO 制造商全稱:AVAGO TECHNOLOGIES LIMITED 功能描述:TD-SCDMA Power Amplifier |
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