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參數(shù)資料
| 型號： | ACPM-7812-BLK |
| 元件分類： | 放大器 |
| 英文描述： | 824 MHz - 849 MHz RF/MICROWAVE NARROW BAND MEDIUM POWER AMPLIFIER |
| 封裝： | 6 X 6 MM, 1.80 MM HEIGHT, SMT, 6 PIN |
| 文件頁數(shù)： | 16/24頁 |
| 文件大?。?/td> | 193K |
| 代理商： | ACPM-7812-BLK |
23
Zone 1 – Preheat Zone
The average heat up rate for
surface-mount component on
PCB shall be less than 3
°C/
second to allow even heating for
both the component and PCB.
This ramp is maintained until it
reaches 100
°C where flux
activation starts.
Zone 2 – Soak Zone
The flux is being activated here
to prepare for even and smooth
solder joint in subsequent zone.
The temperature ramp is kept
gradual to minimize thermal
mismatch between solder, PC
Board and components. Over-
ramp rate here can cause solder
splatter due to excessive oxida-
tion of paste.
Zone 3 – Reflow Zone
The third process zone is the
solder reflow zone. The tempera-
ture in this zone rises rapidly
from 183
°C to peak temperature
of 235
°C for the solder to trans-
form its phase from solid to
liquids. The dwell time at melting
point 183
°C shall maintain at
between 60 to 150 seconds. Upon
the duration of 10-20 seconds at
peak temperature, it is then
cooled down rapidly to allow the
solder to freeze and form solid.
Extended duration above the
solder melting point can poten-
tially damage temperature
sensitive components and result
in excessive inter-metallic growth
that causes brittle solder joint,
weak and unreliable connections.
It can lead to unnecessary dam-
age to the PC Board and discol-
oration to component’s leads.
Zone 4 – Cooling Zone
The temperature ramp down rate
is 6
°C/second maximum. It is
important to control the cooling
rate as fast as possible in order
to achieve the smaller grain size
for solder and increase fatigue
resistance of solder joint.
Solder Paste
The recommended solder paste is
type Sn6337A or Sn60Pb40A of
J-STD-006.
Note: Solder paste storage and shelf
life shall be in accordance with
manufacturer’s specifications.
Stencil or Screen
The solder paste may be depos-
ited onto PCB by either screen
printing, using a stencil or
syringe dispensing. The recom-
mended stencil thickness is in
accordance to JESD22-B102-C.
Nominal stencil thickness
Component lead pitch
0.102 mm (0.004 in)
Lead pitch less than 0.508 mm (0.020 in)
0.152 mm (0.006 in)
0.508 mm to 0.635 mm (0.02 in to 0.025 in)
0.203 mm (0.008 in)
Lead pitch greater than 0.635 mm (0.025 in)
相關PDF資料 |
PDF描述 |
|---|---|
| ACPM-7813-BLK | 824 MHz - 849 MHz RF/MICROWAVE NARROW BAND MEDIUM POWER AMPLIFIER |
| ACPM-7833 | 1850 MHz - 1910 MHz RF/MICROWAVE NARROW BAND MEDIUM POWER AMPLIFIER |
| ACPM-7881-TR1 | 1920 MHz - 1980 MHz RF/MICROWAVE NARROW BAND MEDIUM POWER AMPLIFIER |
| ACPM-7886-BLK | 2010 MHz - 2025 MHz RF/MICROWAVE NARROW BAND MEDIUM POWER AMPLIFIER |
| ACPM-7886-TR1 | 2010 MHz - 2025 MHz RF/MICROWAVE NARROW BAND MEDIUM POWER AMPLIFIER |
相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| ACPM-7812-TR1 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Amplifier. Other |
| ACPM-7813 | 制造商:Avago Technologies 功能描述:824 MHz - 849 MHz RF/MICROWAVE NARROW BAND MEDIUM POWER AMPLIFIER |
| ACPM-7813-BLK | 功能描述:射頻放大器 CDMA Amp 824-849MHz RoHS:否 制造商:Skyworks Solutions, Inc. 類型:Low Noise Amplifier 工作頻率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 輸出截獲點:37.5 dBm 功率增益類型:32 dB 噪聲系數(shù):0.85 dB 工作電源電壓:5 V 電源電流:125 mA 測試頻率:2.6 GHz 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:QFN-16 封裝:Reel |
| ACPM-7813-TR1 | 功能描述:射頻放大器 CDMA Amp 824-849MHz RoHS:否 制造商:Skyworks Solutions, Inc. 類型:Low Noise Amplifier 工作頻率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 輸出截獲點:37.5 dBm 功率增益類型:32 dB 噪聲系數(shù):0.85 dB 工作電源電壓:5 V 電源電流:125 mA 測試頻率:2.6 GHz 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:QFN-16 封裝:Reel |
| ACPM-7821 | 制造商:AVAGO 制造商全稱:AVAGO TECHNOLOGIES LIMITED 功能描述:4 x 4 Power Amplifier Module for J-CDMA (898 - 925 MHz) |
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