參數(shù)資料
型號: ACPM-7812-BLK
元件分類: 放大器
英文描述: 824 MHz - 849 MHz RF/MICROWAVE NARROW BAND MEDIUM POWER AMPLIFIER
封裝: 6 X 6 MM, 1.80 MM HEIGHT, SMT, 6 PIN
文件頁數(shù): 15/24頁
文件大?。?/td> 193K
代理商: ACPM-7812-BLK
22
IR Reflow Soldering
Figure 22 is a straight-line
representation of the recom-
mended nominal time-tempera-
ture profile from JESD22-A113-B
IR reflow.
Figure 22. Time-temperature Profile for IR Reflow Soldering Process.
Process Zone
Temperature
Temperature/Time
Preheat Zone
25
°C to 100°C3°C/s MAX
Soak Zone
100
°C to 150°C
0.5
°C/s MAX (120s MAX)
Reflow Zone
150
°C to 235°C (240°C MAX)
4.5
°C/s TYP
235
°C to 150°C
-4.5
°C/s TYP
Cooling Zone
150
°C to 25°C-6°C/s MAX
Table1. IR Reflow Process Zone.
Convection or IR/Convection
Average ramp-up rate (183
°C to peak)
3
°C/second max.
Preheat temperature 125 (
± 25)°C
120 seconds max.
Temperature maintained above 183
°C
60 – 150 seconds
Time within 5
°C of actual peak temperature
10 – 20 seconds
Peak temperature range
220 +5/-0
°C or 235 +5/-0°C
Ramp-down rate
6
°C/second max.
Time 25
°C to peak temperature
6 minutes max.
Table 2. Classification Reflow Profiles.
Note:
All temperatures measured refer to the package body surface.
TIME (seconds)
TEMPERATURE
(°
C)
0
50
150
100
200
183
235
60
90
30
120
150
210
180
270
300
240
60 to 150s
above 183
°C
Cooling
Zone
Reflow
Zone
Soak
Zone
Preheat
Zone
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