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參數(shù)資料
| 型號： | AAT1236IRN-T1 |
| 廠商： | Advanced Analog Technology,lnc. |
| 元件分類： | LED驅(qū)動器 |
| 英文描述： | High Efficiency White LED Drivers for Backlight and Keypad |
| 中文描述： | 高效率白光LED的背光和鍵盤驅(qū)動程序 |
| 文件頁數(shù)： | 21/24頁 |
| 文件大?。?/td> | 1009K |
| 代理商： | AAT1236IRN-T1 |
AAT1236
High Efficiency White LED Drivers
for Backlight and Keypad
1236.2007.02.1.1
21
PCB Layout Guidelines
Boost converter performance can be adversely
affected by poor layout. Possible impact includes
high input and output voltage ripple, poor EMI per-
formance, and reduced operating efficiency. Every
attempt should be made to optimize the layout in
order to minimize parasitic PCB effects (stray
resistance, capacitance, and inductance) and EMI
coupling from the high frequency SW node. A sug-
gested PCB layout for the AAT1236 boost convert-
er is shown in Figures 10 and 11. The following
PCB layout guidelines should be considered:
1. Minimize the distance from Capacitor C1 and
C2’s negative terminals to the GND pins. This
is especially true with output capacitor C2,
which conducts high ripple current from the
output diode back to the GND pins.
2. Minimize the distance between L1 to D1 and
switching pin SW; minimize the size of the PCB
area connected to the SW pin.
3. Maintain a ground plane and connect to the IC
GND pin(s) as well as the GND connections of
C1 and C2.
4. Consider additional PCB metal area on D1’s
cathode to maximize heatsinking capability.
This may be necessary when using a diode
with a high V
F
and/or thermal resistance.
5. Do not connect the exposed paddle (bottom of
the die) to either AGND or GND because it is
connected internally to SW. Connect the
exposed paddle to the SW pin or leave floating.
Figure 10: AAT1236 Evaluation Board
Top Side Layout.
Figure 11: AAT1236 Evaluation Board
Bottom Side Layout.
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