參數(shù)資料
型號(hào)： A80960JD
廠商： Intel Corp.
英文描述： 3.3 V EMBEDDED 32-BIT MICROPROCESSOR
中文描述： 3.3伏嵌入式32位微處理器
文件頁數(shù)： 3/78頁
文件大?。?/td> 835K
代理商： A80960JD
Advance Information Datasheet
3
80960JA/JF/JD/JT 3.3 V Microprocessor
Contents
1.0
2.0
Introduction
..................................................................................................................7
80960Jx Overview
......................................................................................................7
2.1
80960 Processor Core ..........................................................................................9
2.2
Burst Bus.............................................................................................................10
2.3
Timer Unit............................................................................................................10
2.4
Priority Interrupt Controller..................................................................................10
2.5
Instruction Set Summary.....................................................................................11
2.6
Faults and Debugging.........................................................................................11
2.7
Low Power Operation..........................................................................................11
2.8
Test Features......................................................................................................12
2.9
Memory-Mapped Control Registers ....................................................................12
2.10
Data Types and Memory Addressing Modes......................................................12
Package Information
...............................................................................................14
3.1
Pin Descriptions ..................................................................................................16
3.1.1
Functional Pin Definitions.......................................................................16
3.1.2
80960Jx 132-Lead PGA Pinout..............................................................22
3.1.3
80960Jx 132-Lead PQFP Pinout............................................................26
3.1.4
80960Jx 196-Ball MPBGA Pinout ..........................................................29
3.2
Package Thermal Specifications.........................................................................34
3.3
Thermal Management Accessories.....................................................................38
3.3.1
Heatsinks................................................................................................38
Electrical Specifications
........................................................................................39
4.1
Absolute Maximum Ratings.................................................................................39
4.2
Operating Conditions...........................................................................................39
4.3
Connection Recommendations...........................................................................40
4.4
VCC5 Pin Requirements (VDIFF) .......................................................................40
4.5
VCCPLL Pin Requirements.................................................................................41
4.6
DC Specifications................................................................................................42
4.7
AC Specifications................................................................................................44
4.7.1
AC Test Conditions and Derating Curves ..............................................47
4.7.2
AC Timing Waveforms ...........................................................................52
Bus Functional Waveforms
..................................................................................58
5.1
Basic Bus States.................................................................................................68
5.2
Boundary-Scan Register.....................................................................................69
Device Identification
...............................................................................................74
Revision History
.......................................................................................................77
3.0
4.0
5.0
6.0
7.0
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
A80960JD-33 制造商:INTEL 制造商全稱:Intel Corporation 功能描述:EMBEDDED 32-BIT MICROPROCESSOR
A80960JD3V33 功能描述:IC MPU I960JD 3.3V 33MHZ 132-PGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - 微處理器 系列:- 標(biāo)準(zhǔn)包裝:40 系列:MPC83xx 處理器類型:32-位 MPC83xx PowerQUICC II Pro 特點(diǎn):- 速度:267MHz 電壓:0.95 V ~ 1.05 V 安裝類型:表面貼裝 封裝/外殼:516-BBGA 裸露焊盤 供應(yīng)商設(shè)備封裝:516-PBGAPGE（27x27） 包裝:托盤
A80960JD3V50 功能描述:IC MPU I960JD 3V 50MHZ 132-PGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微處理器 系列:- 標(biāo)準(zhǔn)包裝:40 系列:MPC83xx 處理器類型:32-位 MPC83xx PowerQUICC II Pro 特點(diǎn):- 速度:267MHz 電壓:0.95 V ~ 1.05 V 安裝類型:表面貼裝 封裝/外殼:516-BBGA 裸露焊盤 供應(yīng)商設(shè)備封裝:516-PBGAPGE（27x27） 包裝:托盤
A80960JD3V66 功能描述:IC MPU I960JD 3V 66MHZ 132-QFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - 微處理器 系列:- 標(biāo)準(zhǔn)包裝:40 系列:MPC83xx 處理器類型:32-位 MPC83xx PowerQUICC II Pro 特點(diǎn):- 速度:267MHz 電壓:0.95 V ~ 1.05 V 安裝類型:表面貼裝 封裝/外殼:516-BBGA 裸露焊盤 供應(yīng)商設(shè)備封裝:516-PBGAPGE（27x27） 包裝:托盤
A80960JD-40 制造商:INTEL 制造商全稱:Intel Corporation 功能描述:EMBEDDED 32-BIT MICROPROCESSOR
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