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參數(shù)資料
型號： A42MX16-TQG176A
廠商： Microsemi SoC
文件頁數(shù)： 119/142頁
文件大小： 0K
描述： IC FPGA MX SGL CHIP 24K 176-TQFP
標準包裝： 40
系列： MX
輸入/輸出數(shù)： 140
門數(shù)： 24000
電源電壓： 3 V ~ 3.6 V，4.5 V ~ 5.5 V
安裝類型： 表面貼裝
工作溫度： -40°C ~ 125°C
封裝/外殼： 176-LQFP
供應(yīng)商設(shè)備封裝： 176-TQFP（24x24）
40MX and 42MX FPGA Families
1- 74
R e v i sio n 1 1
Table 1-38 A42MX36 Timing Characteristics (Nominal 5.0 V Operation)
(Worst-Case Commercial Conditions, VCCA = 4.75 V, TJ = 70°C)
–3 Speed
–2 Speed
–1 Speed
Std Speed
–F Speed
Parameter / Description
Min. Max. Min. Max. Min. Max. Min. Max. Min.
Max. Units
Logic Module Combinatorial Functions1
tPD
Internal Array Module Delay
1.3
1.5
1.7
2.0
2.7
ns
tPDD
Internal Decode Module Delay
1.6
1.8
2.0
2.4
3.3
ns
Logic Module Predicted Routing Delays2
tRD1
FO = 1 Routing Delay
0.9
1.0
1.2
1.4
2.0
ns
tRD2
FO = 2 Routing Delay
1.3
1.4
1.6
1.9
2.7
ns
tRD3
FO =3 Routing Delay
1.6
1.8
2.0
2.4
3.4
ns
tRD4
FO = 4 Routing Delay
2.0
2.2
2.5
2.9
4.1
ns
tRD5
FO = 8 Routing Delay
3.3
3.7
4.2
4.9
6.9
ns
tRDD
Decode-to-Output Routing Delay
0.3
0.4
0.5
0.7
ns
Logic Module Sequential Timing3, 4
tCO
Flip-Flop Clock-to-Output
1.3
1.4
1.6
1.9
2.7
ns
tGO
Latch Gate-to-Output
1.3
1.4
1.6
1.9
2.7
ns
tSUD
Flip-Flop (Latch) Set-Up Time
0.3
0.4
0.5
0.7
ns
tHD
Flip-Flop (Latch) Hold Time
0.0
ns
tRO
Flip-Flop (Latch) Reset-to-Output
1.6
1.7
2.0
2.3
3.2
ns
tSUENA
Flip-Flop (Latch) Enable Set-Up
0.7
0.8
0.9
1.0
1.4
ns
tHENA
Flip-Flop (Latch) Enable Hold
0.0
ns
tWCLKA
Flip-Flop (Latch) Clock Active
Pulse Width
3.3
3.7
4.2
4.9
6.9
ns
tWASYN
Flip-Flop (Latch) Asynchronous
Pulse Width
4.4
4.8
5.5
6.4
9.0
ns
Synchronous SRAM Operations
tRC
Read Cycle Time
6.8
7.5
8.5
10.0
14.0
ns
tWC
Write Cycle Time
6.8
7.5
8.5
10.0
14.0
ns
tRCKHL
Clock HIGH/LOW Time
3.4
3.8
4.3
5.0
7.0
ns
tRCO
Data Valid After Clock HIGH/LOW
3.4
3.8
4.3
5.0
7.0
ns
tADSU
Address/Data Set-Up Time
1.6
1.8
2.0
2.4
3.4
ns
Synchronous SRAM Operations (continued)
tADH
Address/Data Hold Time
0.0
ns
Notes:
1. For dual-module macros, use tPD1 + tRD1 + tPDn, tCO + tRD1 + tPDn, or tPD1 + tRD1 + tSUD, whichever is appropriate.
2. Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for
estimating device performance. Post-route timing analysis or simulation is required to determine actual performance.
3. Data applies to macros based on the S-module. Timing parameters for sequential macros constructed from C-modules
can be obtained from the Timer utility.
4. Set-up and hold timing parameters for the Input Buffer Latch are defined with respect to the PAD and the D input.
External setup/hold timing parameters must account for delay from an external PAD signal to the G inputs. Delay from an
external PAD signal to the G input subtracts (adds) to the internal setup (hold) time.
5. Delays based on 35 pF loading.
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參數(shù)描述
A42MX16-TQG176I 功能描述:IC FPGA MX SGL CHIP 24K 176-TQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:MX 標準包裝:40 系列:SX-A LAB/CLB數(shù):6036 邏輯元件/單元數(shù):- RAM 位總計:- 輸入/輸出數(shù):360 門數(shù):108000 電源電壓:2.25 V ~ 5.25 V 安裝類型:表面貼裝 工作溫度:0°C ~ 70°C 封裝/外殼:484-BGA 供應(yīng)商設(shè)備封裝:484-FPBGA（27X27）
A42MX16-TQG176M 制造商:Microsemi Corporation 功能描述:FPGA 24K GATES 608 CELLS 103MHZ/172MHZ 0.45UM 3.3V/5V 176TQF - Trays 制造商:Microsemi Corporation 功能描述:IC FPGA 140 I/O 176TQFP
A42MX16-TQG176X288 制造商:Microsemi Corporation 功能描述:
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