2-62 Revision 13 Timing Characteristics Figure 2-33 Output DDR Timing Diagram 11 6 1 7 2" />
參數(shù)資料
型號: A3PE3000-2FGG324
廠商: Microsemi SoC
文件頁數(shù): 137/162頁
文件大?。?/td> 0K
描述: IC FPGA 1KB FLASH 3M 324-FBGA
標(biāo)準(zhǔn)包裝: 84
系列: ProASIC3E
RAM 位總計(jì): 516096
輸入/輸出數(shù): 221
門數(shù): 3000000
電源電壓: 1.425 V ~ 1.575 V
安裝類型: 表面貼裝
工作溫度: 0°C ~ 70°C
封裝/外殼: 324-BGA
供應(yīng)商設(shè)備封裝: 324-FBGA(19x19)
ProASIC3E DC and Switching Characteristics
2-62
Revision 13
Timing Characteristics
Figure 2-33 Output DDR Timing Diagram
11
6
1
7
2
8
3
910
45
28
3
9
tDDROREMCLR
tDDROHD1
tDDROREMCLR
tDDROHD2
tDDROSUD2
tDDROCLKQ
tDDRORECCLR
CLK
Data_R
Data_F
CLR
Out
tDDROCLR2Q
710
4
Table 2-92 Output DDR Propagation Delays
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V
Parameter
Description
–2
–1
Std.
Units
tDDROCLKQ
Clock-to-Out of DDR for Output DDR
0.70
0.80
0.94
ns
tDDROSUD1
Data_F Data Setup for Output DDR
0.38
0.43
0.51
ns
tDDROSUD2
Data_R Data Setup for Output DDR
0.38
0.43
0.51
ns
tDDROHD1
Data_F Data Hold for Output DDR
0.00
ns
tDDROHD2
Data_R Data Hold for Output DDR
0.00
ns
tDDROCLR2Q
Asynchronous Clear-to-Out for Output DDR
0.80
0.91
1.07
ns
tDDROREMCLR
Asynchronous Clear Removal Time for Output DDR
0.00
ns
tDDRORECCLR
Asynchronous Clear Recovery Time for Output DDR
0.22
0.25
0.30
ns
tDDROWCLR1
Asynchronous Clear Minimum Pulse Width for Output DDR
0.22
0.25
0.30
ns
tDDROCKMPWH
Clock Minimum Pulse Width High for the Output DDR
0.36
0.41
0.48
ns
tDDROCKMPWL
Clock Minimum Pulse Width Low for the Output DDR
0.32
0.37
0.43
ns
FDDOMAX
Maximum Frequency for the Output DDR
1404 1232 1048
MHz
Note: For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-5 for derating values.
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