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參數(shù)資料
| 型號(hào)： | A3P400-2FGG256I |
| 廠商： | Microsemi SoC |
| 文件頁(yè)數(shù)： | 134/220頁(yè) |
| 文件大?。?/td> | 0K |
| 描述： | IC FPGA 1KB FLASH 400K 256-FBGA |
| 標(biāo)準(zhǔn)包裝： | 90 |
| 系列： | ProASIC3 |
| RAM 位總計(jì)： | 55296 |
| 輸入/輸出數(shù)： | 178 |
| 門(mén)數(shù)： | 400000 |
| 電源電壓： | 1.425 V ~ 1.575 V |
| 安裝類(lèi)型： | 表面貼裝 |
| 工作溫度： | -40°C ~ 85°C |
| 封裝/外殼： | 256-LBGA |
| 供應(yīng)商設(shè)備封裝： | 256-FPBGA（17x17） |
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ProASIC3 Flash Family FPGAs
Revision 13
5-13
Datasheet Categories
Categories
In order to provide the latest information to designers, some datasheet parameters are published before
data has been fully characterized from silicon devices. The data provided for a given device, as
highlighted in the "ProASIC3 Device Status" table on page III, is designated as either "Product Brief,"
"Advance," "Preliminary," or "Production." The definitions of these categories are as follows:
Product Brief
The product brief is a summarized version of a datasheet (advance or production) and contains general
product information. This document gives an overview of specific device and family information.
Advance
This version contains initial estimated information based on simulation, other products, devices, or speed
grades. This information can be used as estimates, but not for production. This label only applies to the
DC and Switching Characteristics chapter of the datasheet and will only be used when the data has not
been fully characterized.
Preliminary
The datasheet contains information based on simulation and/or initial characterization. The information is
believed to be correct, but changes are possible.
Unmarked (production)
This version contains information that is considered to be final.
Export Administration Regulations (EAR)
The products described in this document are subject to the Export Administration Regulations (EAR).
They could require an approved export license prior to export from the United States. An export includes
release of product or disclosure of technology to a foreign national inside or outside the United States.
Safety Critical, Life Support, and High-Reliability Applications
Policy
The products described in this advance status document may not have completed the Microsemi
qualification process. Products may be amended or enhanced during the product introduction and
qualification process, resulting in changes in device functionality or performance. It is the responsibility of
each customer to ensure the fitness of any product (but especially a new product) for a particular
purpose, including appropriateness for safety-critical, life-support, and other high-reliability applications.
Consult the Microsemi SoC Products Group Terms and Conditions for specific liability exclusions relating
to life-support applications. A reliability report covering all of the SoC Products Group’s products is
available at http://www.microsemi.com/soc/documents/ORT_Report.pdf. Microsemi also offers a variety
of enhanced qualification and lot acceptance screening procedures. Contact your local sales office for
additional reliability information.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| M1A3P400-2FG256I | IC FPGA 1KB FLASH 400K 256-FBGA |
| EP4CGX22BF14C6N | IC CYCLONE IV GX FPGA 22K 169FBG |
| ACC43DRTH-S93 | CONN EDGECARD 86POS DIP .100 SLD |
| AMC26DRYS | CONN EDGECARD 52POS .100 DIP SLD |
| EP4CE22F17C8L | IC CYCLONE IV FPGA 22K 256FBGA |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| A3P400-2FGG484 | 功能描述:IC FPGA 1KB FLASH 400K 484-FBGA RoHS:是 類(lèi)別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門(mén)陣列） 系列:ProASIC3 標(biāo)準(zhǔn)包裝:90 系列:ProASIC3 LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計(jì):36864 輸入/輸出數(shù):157 門(mén)數(shù):250000 電源電壓:1.425 V ~ 1.575 V 安裝類(lèi)型:表面貼裝 工作溫度:-40°C ~ 125°C 封裝/外殼:256-LBGA 供應(yīng)商設(shè)備封裝:256-FPBGA（17x17） |
| A3P400-2FGG484I | 功能描述:IC FPGA 1KB FLASH 400K 484-FBGA RoHS:是 類(lèi)別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門(mén)陣列） 系列:ProASIC3 標(biāo)準(zhǔn)包裝:90 系列:ProASIC3 LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計(jì):36864 輸入/輸出數(shù):157 門(mén)數(shù):250000 電源電壓:1.425 V ~ 1.575 V 安裝類(lèi)型:表面貼裝 工作溫度:-40°C ~ 125°C 封裝/外殼:256-LBGA 供應(yīng)商設(shè)備封裝:256-FPBGA（17x17） |
| A3P400-2PQ144 | 制造商:ACTEL 制造商全稱:Actel Corporation 功能描述:ProASIC3 Flash Family FPGAs |
| A3P400-2PQ144ES | 制造商:ACTEL 制造商全稱:Actel Corporation 功能描述:ProASIC3 Flash Family FPGAs |
| A3P400-2PQ144I | 制造商:ACTEL 制造商全稱:Actel Corporation 功能描述:ProASIC3 Flash Family FPGAs |
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