參數(shù)資料
型號(hào)： A3P125-QN132II
元件分類(lèi)： FPGA
英文描述： FPGA, 3072 CLBS, 125000 GATES, 350 MHz, BCC132
封裝： 8 X 8 MM, 0.75 MM HEIGHT, 0.50 MM PITCH, QFN-132
文件頁(yè)數(shù)： 29/49頁(yè)
文件大小： 5893K
代理商： A3P125-QN132II
ProASIC3 DC and Switching Characteristics
2- 108
v1.3
Advance v0.3
M7 device information is new.
N/A
Table 2-4 ProASIC3 Globals/Spines/Rows by Device was updated to include the
number or rows in each top or bottom spine.
2-16
EXTFB was removed from Figure 2-24 ProASIC3E CCC Options.
2-24
The "PLL Macro" section was updated. EXTFB information was removed from
this section.
2-15
The CCC Output Peak-to-Peak Period Jitter FCCC_OUT was updated in Table 2-
11 ProASIC3 CCC/PLL Specification
2-29
EXTFB was removed from Figure 2-27 CCC/PLL Macro.
2-28
Table 2-13 ProASIC3 I/O Features was updated.
2-30
The "Hot-Swap Support" section was updated.
2-33
The "Cold-Sparing Support" section was updated.
2-34
"Electrostatic Discharge (ESD) Protection" section was updated.
2-35
The LVPECL specification in Table 2-43 I/O Hot-Swap and 5 V Input Tolerance
Capabilities in ProASIC3 Devices was updated.
2-64
In the Bank 1 area of Figure 2-72, VMV2 was changed to VMV1 and VCCIB2 was
changed to VCCIB1.
2-97
The VJTAG and I/O pin descriptions were updated in the "Pin Descriptions"
section.
2-50
The "JTAG Pins" section was updated.
2-51
"128-Bit AES Decryption" section was updated to include M7 device
information.
2-53
Table 3-6 was updated.
3-6
Table 3-7 was updated.
3-6
In Table 3-11, PAC4 was updated.
3-93-8
Table 3-20 was updated.
3-20
The note in Table 3-32 was updated.
3-27
All Timing Characteristics tables were updated from LVTTL to Register Delays
3-31 to
3-73
The Timing Characteristics for RAM4K9, RAM512X18, and FIFO were updated.
3-85 to
3-90
FTCKMAX was updated in Table 3-110.
3-97
Advance v0.2
Figure 2-11 was updated.
2-9
The "Clock Resources (VersaNets)" section was updated.
2-9
The "VersaNet Global Networks and Spine Access" section was updated.
2-9
The "PLL Macro" section was updated.
2-15
Figure 2-27 was updated.
2-28
Figure 2-20 was updated.
2-19
Table 2-5 was updated.
2-25
Table 2-6 was updated.
2-25
Previous Version
Changes in Current Version (v1.3)
Page
相關(guān)PDF資料
PDF描述
A3P125-QNG132II FPGA, 3072 CLBS, 125000 GATES, 350 MHz, BCC132
A3P125-TQ144II FPGA, 3072 CLBS, 125000 GATES, 350 MHz, PQFP144
A3P125-TQG144II FPGA, 3072 CLBS, 125000 GATES, 350 MHz, PQFP144
A3P125-VQ100II FPGA, 3072 CLBS, 125000 GATES, 350 MHz, PQFP100
A3P125-VQG100II FPGA, 3072 CLBS, 125000 GATES, 350 MHz, PQFP100
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
A3P125-QNG132 功能描述:IC FPGA 1024MAC 133I/O 132QFN RoHS:是 類(lèi)別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門(mén)陣列） 系列:ProASIC3 標(biāo)準(zhǔn)包裝:60 系列:XP LAB/CLB數(shù):- 邏輯元件/單元數(shù):10000 RAM 位總計(jì):221184 輸入/輸出數(shù):244 門(mén)數(shù):- 電源電壓:1.71 V ~ 3.465 V 安裝類(lèi)型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:388-BBGA 供應(yīng)商設(shè)備封裝:388-FPBGA（23x23） 其它名稱(chēng):220-1241
A3P125-QNG132I 功能描述:IC FPGA 1KB FLASH 125K 132-QFN RoHS:是 類(lèi)別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門(mén)陣列） 系列:ProASIC3 標(biāo)準(zhǔn)包裝:152 系列:IGLOO PLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):792 RAM 位總計(jì):- 輸入/輸出數(shù):120 門(mén)數(shù):30000 電源電壓:1.14 V ~ 1.575 V 安裝類(lèi)型:表面貼裝 工作溫度:-40°C ~ 85°C 封裝/外殼:289-TFBGA，CSBGA 供應(yīng)商設(shè)備封裝:289-CSP（14x14）
A3P125-QNG132T 功能描述:IC FPGA 1KB FLASH 125K 132-QFN RoHS:是 類(lèi)別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門(mén)陣列） 系列:ProASIC3 標(biāo)準(zhǔn)包裝:90 系列:ProASIC3 LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計(jì):36864 輸入/輸出數(shù):157 門(mén)數(shù):250000 電源電壓:1.425 V ~ 1.575 V 安裝類(lèi)型:表面貼裝 工作溫度:-40°C ~ 125°C 封裝/外殼:256-LBGA 供應(yīng)商設(shè)備封裝:256-FPBGA（17x17）
A3P125-TQ144 功能描述:IC FPGA 1KB FLASH 125K 144-TQFP RoHS:否 類(lèi)別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門(mén)陣列） 系列:ProASIC3 標(biāo)準(zhǔn)包裝:152 系列:IGLOO PLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):792 RAM 位總計(jì):- 輸入/輸出數(shù):120 門(mén)數(shù):30000 電源電壓:1.14 V ~ 1.575 V 安裝類(lèi)型:表面貼裝 工作溫度:-40°C ~ 85°C 封裝/外殼:289-TFBGA，CSBGA 供應(yīng)商設(shè)備封裝:289-CSP（14x14）
A3P125-TQ144I 功能描述:IC FPGA 1KB FLASH 125K 144-TQFP RoHS:否 類(lèi)別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門(mén)陣列） 系列:ProASIC3 標(biāo)準(zhǔn)包裝:152 系列:IGLOO PLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):792 RAM 位總計(jì):- 輸入/輸出數(shù):120 門(mén)數(shù):30000 電源電壓:1.14 V ~ 1.575 V 安裝類(lèi)型:表面貼裝 工作溫度:-40°C ~ 85°C 封裝/外殼:289-TFBGA，CSBGA 供應(yīng)商設(shè)備封裝:289-CSP（14x14）
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