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參數(shù)資料
| 型號： | A1174EEWLT-T |
| 元件分類： | 磁阻傳感器 |
| 英文描述： | MAGNETIC FIELD SENSOR-HALL EFFECT, -5.5-5.5mT, 300mV, RECTANGULAR, SURFACE MOUNT |
| 封裝： | 1.50 X 2 MM, 0.40 MM HEIGHT, LEAD FREE, DFN-6 |
| 文件頁數(shù)： | 5/13頁 |
| 文件大?。?/td> | 423K |
| 代理商： | A1174EEWLT-T |
Ultrasensitive Hall Effect Latch
with Internally or Externally Controlled Sample and Sleep Periods
for Track Ball and Scroll Wheel Applications
A1174
13
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
F
SEATING
PLANE
0.38
0.50
0.25
0.70
1.10
0.30
0.70
1.575
0.50
0.15
1.25
0.325
2.00
1.00
0.74
1.50
C
0.08
7X
C
A
1
6
1
6
A Terminal #1 mark area
Active Area Depth
B
F
Exposed thermal pad (reference only, terminal #1
identifier appearance at supplier discretion)
All dimensions nominal, not for tooling use
(similar to JEDEC Type 1, MO-229”X2”BCD)
Dimensions in millimeters
Exact case and lead configuration at supplier discretion within limits shown
C
E
Reference land pattern layout (reference IPC7351
SON50P200X200X80-7-M);
All pads a minimum of 0.20 mm from all adjacent pads; adjust as
necessary to meet application process requirements and PCB layout
tolerances; when mounting on a multilayer PCB, thermal vias at the
exposed thermal pad land can improve thermal dissipation (reference
EIA/JEDEC Standard JESD51-5)
E
Hall element (not to scale)
B
PCB Layout Reference View
C
D
D Coplanarity includes exposed thermal pad and terminals
Copyright 2008, Allegro MicroSystems, Inc.
The products described herein are manufactured under one or more of the following U.S. patents: 5,045,920; 5,264,783; 5,442,283; 5,389,889;
5,581,179; 5,517,112; 5,619,137; 5,621,319; 5,650,719; 5,686,894; 5,694,038; 5,729,130; 5,917,320; and other patents pending.
Allegro MicroSystems, Inc. reserves the right to make, from time to time, such departures from the detail specifications as may be required to per-
mit improvements in the performance, reliability, or manufacturability of its products. Before placing an order, the user is cautioned to verify that the
information being relied upon is current.
Allegro’s products are not to be used in life support devices or systems, if a failure of an Allegro product can reasonably be expected to cause the
failure of that life support device or system, or to affect the safety or effectiveness of that device or system.
The information included herein is believed to be accurate and reliable. However, Allegro MicroSystems, Inc. assumes no responsibility for its use;
nor for any infringement of patents or other rights of third parties which may result from its use.
For the latest version of this document, visit our website:
www.allegromicro.com
Package EW 6-Contact MLP/DFN
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