參數(shù)資料
型號(hào): A10V10B-VQG80C
廠商: Microsemi SoC
文件頁(yè)數(shù): 78/98頁(yè)
文件大小: 0K
描述: IC FPGA 1200 GATES 80-VQFP COM
標(biāo)準(zhǔn)包裝: 90
系列: ACT™ 1
LAB/CLB數(shù): 295
輸入/輸出數(shù): 57
門數(shù): 1200
電源電壓: 2.7 V ~ 3.6 V
安裝類型: 表面貼裝
工作溫度: 0°C ~ 70°C
封裝/外殼: 80-TQFP
供應(yīng)商設(shè)備封裝: 80-VQFP(14x14)
8
Ac t e l MI L- S T D- 8 83 P r o d u c t Fl o w
Step
Screen
883 Method
883—Class B
Requirement
1.
Internal Visual
2010, Test Condition B
100%
2.
Temperature Cycling
1010, Test Condition C
100%
3.
Constant Acceleration
2001, Test Condition D or E,
Y1, Orientation Only
100%
4.
Seal
a. Fine
b. Gross
1014
100%
5.
Visual Inspection
2009
100%
6.
Pre-Burn-In
Electrical Parameters
In accordance with applicable Actel
device specification
100%
7.
Burn-in Test
1015, Condition D,
160 hours @ 125°C or 80 hours @ 150°C
100%
8.
Interim (Post-Burn-In)
Electrical Parameters
In accordance with applicable Actel
device specification
100%
9.
Percent Defective Allowable
5%
All Lots
10.
Final Electrical Test
a. Static Tests
(1) 25°C
(Subgroup 1, Table I)
(2) –55°C and +125°C
(Subgroups 2, 3, Table I)
b. Functional Tests
(1) 25°C
(Subgroup 7, Table I)
(2) –55°C and +125°C
(Subgroups 8A and 8B, Table I)
c. Switching Tests at 25°C
(Subgroup 9, Table I)
In accordance with applicable Actel
device specification, which includes a, b, and c:
5005
100%
11.
External Visual
2009
100%
Note:
When Destructive Physical Analysis (DPA) is performed on Class B devices, the step coverage requirement as specified in Method 2018
must be waived.
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