(W or s t - C as e M i l i t a r y Cond i t i o n s , V
參數(shù)資料
型號(hào)： A10V10B-VQG80C
廠商： Microsemi SoC
文件頁數(shù)： 18/98頁
文件大小： 0K
描述： IC FPGA 1200 GATES 80-VQFP COM
標(biāo)準(zhǔn)包裝： 90
系列： ACT™ 1
LAB/CLB數(shù)： 295
輸入/輸出數(shù)： 57
門數(shù)： 1200
電源電壓： 2.7 V ~ 3.6 V
安裝類型： 表面貼裝
工作溫度： 0°C ~ 70°C
封裝/外殼： 80-TQFP
供應(yīng)商設(shè)備封裝： 80-VQFP（14x14）
25
Hi R e l F P GA s
AC T 1 T i m i ng C har a c t e r i st i c s
(W or s t - C as e M i l i t a r y Cond i t i o n s , V CC = 4.5 V, TJ = 1 25°C)
‘–1’ Speed
‘Std’ Speed
Parameter
Description
Min.
Max.
Min.
Max.
Units
Logic Module Propagation Delays
tPD1
Single Module
4.7
5.5
ns
tPD2
Dual Module Macros
10.8
12.7
ns
tCO
Sequential Clk to Q
4.7
5.5
ns
tGO
Latch G to Q
4.7
5.5
ns
tRS
Flip-Flop (Latch) Reset to Q
4.7
5.5
ns
Logic Module Predicted Routing Delays1
tRD1
FO=1 Routing Delay
1.5
1.7
ns
tRD2
FO=2 Routing Delay
2.3
2.7
ns
tRD3
FO=3 Routing Delay
3.4
4.0
ns
tRD4
FO=4 Routing Delay
5.0
5.9
ns
tRD8
FO=8 Routing Delay
10.6
12.5
ns
Logic Module Sequential Timing 2
tSUD
Flip-Flop (Latch) Data Input Setup
8.8
10.4
ns
tHD
Flip-Flop (Latch) Data Input Hold
0.0
ns
tSUENA
Flip-Flop (Latch) Enable Setup
8.8
10.4
ns
tHENA
Flip-Flop (Latch) Enable Hold
0.0
ns
tWCLKA
Flip-Flop (Latch) Clock Active Pulse
Width
10.9
12.9
ns
tWASYN
Flip-Flop (Latch) Asynchronous Pulse
Width
10.9
12.9
ns
tA
Flip-Flop Clock Input Period
23.2
27.3
ns
fMAX
Flip-Flop (Latch) Clock
Frequency
44
37
MHz
Input Module Propagation Delays
tINYH
Pad to Y High
4.9
5.8
ns
tINYL
Pad to Y Low
4.9
5.8
ns
Input Module Predicted Routing Delays1, 3
tIRD1
FO=1 Routing Delay
1.5
1.7
ns
tIRD2
FO=2 Routing Delay
2.3
2.7
ns
tIRD3
FO=3 Routing Delay
3.4
4.0
ns
tIRD4
FO=4 Routing Delay
5.0
5.9
ns
tIRD8
FO=8 Routing Delay
10.6
12.5
ns
Notes:
1.
Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for estimating device
performance. Post-route timing analysis or simulation is required to determine actual worst-case performance. Post-route timing is based
on actual routing delay measurements performed on the device prior to shipment.
2.
Setup times assume fanout of 3. Further derating information can be obtained from the DirectTime Analyzer utility.
3.
Optimization techniques may further reduce delays by 0 to 4 ns.
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