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參數(shù)資料
| 型號： | 93LC56C |
| 廠商： | Microchip Technology Inc. |
| 元件分類： | EEPROM |
| 英文描述： | 2K Microwire Compatible Serial EEPROM |
| 中文描述： | 2K微絲兼容串行EEPROM |
| 文件頁數(shù)： | 17/28頁 |
| 文件大?。?/td> | 357K |
| 代理商： | 93LC56C |
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2007 Microchip Technology Inc.
DS21794E-page 17
93AA56A/B/C, 93LC56A/B/C, 93C56A/B/C
8-Lead Plastic Dual In-Line (P or PA) – 300 mil Body [PDIP]
Notes:
1. Pin 1 visual index feature may vary, but must be located with the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
INCHES
NOM
8
.100 BSC
–
.130
–
.310
.250
.365
.130
.010
.060
.018
–
Dimension Limits
MIN
MAX
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing §
N
e
A
A2
A1
E
E1
D
L
c
b1
b
eB
–
.210
.195
–
.325
.280
.400
.150
.015
.070
.022
.430
.115
.015
.290
.240
.348
.115
.008
.040
.014
–
N
E1
NOTE 1
D
1
2
3
A
A1
A2
L
b1
b
e
E
e
B
c
Microchip Technology Drawing C04-018B
相關PDF資料 |
PDF描述 |
|---|---|
| 93LC66B | 4K 2.5V Microwire Serial EEPROM |
| 93LC66B | 4K 2.5V Microwire Serial EEPROM(4K位,2.5V,具上掉電數(shù)據(jù)保護電路,Microwire接口EEPROM) |
| 93LC66A | 4K 2.5V Microwire Serial EEPROM(4K位,2.5V,具上掉電數(shù)據(jù)保護電路,Microwire接口EEPROM) |
| 93LC66 | 4K 2.0V CMOS Serial EEPROM(4K位,2.0V,具上掉電數(shù)據(jù)保護電路,EEPROM) |
| 93LC46 | 1K 2.0V CMOS Serial EEPROM(1K位,2.0V,具上掉電數(shù)據(jù)保護電路,EEPROM) |
相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| 93LC56C/S15K | 制造商:Microchip Technology Inc 功能描述:2K, 256 X 8 OR 128 X 16 SERIAL - Gel-pak, waffle pack, wafer, diced wafer on film |
| 93LC56C/W15K | 制造商:Microchip Technology Inc 功能描述:2K, 256 X 8 OR 128 X 16 SERIAL - Gel-pak, waffle pack, wafer, diced wafer on film |
| 93LC56C/WF15K | 制造商:Microchip Technology Inc 功能描述:2K, 256 X 8 OR 128 X 16 SERIAL - Gel-pak, waffle pack, wafer, diced wafer on film |
| 93LC56C-E/CH | 制造商:MICROCHIP 制造商全稱:Microchip Technology 功能描述:1K-16K Microwire Compatible Serial EEPROMs |
| 93LC56C-E/MC | 制造商:MICROCHIP 制造商全稱:Microchip Technology 功能描述:1K-16K Microwire Compatible Serial EEPROMs |
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