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參數(shù)資料
| 型號(hào)： | 93LC56C |
| 廠商： | Microchip Technology Inc. |
| 元件分類(lèi)： | EEPROM |
| 英文描述： | 2K Microwire Compatible Serial EEPROM |
| 中文描述： | 2K微絲兼容串行EEPROM |
| 文件頁(yè)數(shù)： | 16/28頁(yè) |
| 文件大?。?/td> | 357K |
| 代理商： | 93LC56C |
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93AA56A/B/C, 93LC56A/B/C, 93C56A/B/C
DS21794E-page 16
2007 Microchip Technology Inc.
6-Lead Plastic Small Outline Transistor (CH or OT) [SOT-23]
Notes:
1. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.127 mm per side.
2. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
MILLIMETERS
NOM
6
0.95 BSC
1.90 BSC
–
–
–
–
–
–
–
–
–
–
–
Dimension Limits
MIN
MAX
Number of Pins
Pitch
Outside Lead Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Foot Length
Footprint
Foot Angle
Lead Thickness
Lead Width
N
e
e1
A
A2
A1
E
E1
D
L
L1
φ
c
b
0.90
0.89
0.00
2.20
1.30
2.70
0.10
0.35
0°
0.08
0.20
1.45
1.30
0.15
3.20
1.80
3.10
0.60
0.80
30°
0.26
0.51
b
E
4
N
E1
PIN 1 ID BY
LASER MARK
D
1
2
3
e
e
1
A
A1
A2
c
L
L1
φ
Microchip Technology Drawing C04-028B
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| 93LC66B | 4K 2.5V Microwire Serial EEPROM |
| 93LC66B | 4K 2.5V Microwire Serial EEPROM(4K位,2.5V,具上掉電數(shù)據(jù)保護(hù)電路,Microwire接口EEPROM) |
| 93LC66A | 4K 2.5V Microwire Serial EEPROM(4K位,2.5V,具上掉電數(shù)據(jù)保護(hù)電路,Microwire接口EEPROM) |
| 93LC66 | 4K 2.0V CMOS Serial EEPROM(4K位,2.0V,具上掉電數(shù)據(jù)保護(hù)電路,EEPROM) |
| 93LC46 | 1K 2.0V CMOS Serial EEPROM(1K位,2.0V,具上掉電數(shù)據(jù)保護(hù)電路,EEPROM) |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| 93LC56C/S15K | 制造商:Microchip Technology Inc 功能描述:2K, 256 X 8 OR 128 X 16 SERIAL - Gel-pak, waffle pack, wafer, diced wafer on film |
| 93LC56C/W15K | 制造商:Microchip Technology Inc 功能描述:2K, 256 X 8 OR 128 X 16 SERIAL - Gel-pak, waffle pack, wafer, diced wafer on film |
| 93LC56C/WF15K | 制造商:Microchip Technology Inc 功能描述:2K, 256 X 8 OR 128 X 16 SERIAL - Gel-pak, waffle pack, wafer, diced wafer on film |
| 93LC56C-E/CH | 制造商:MICROCHIP 制造商全稱(chēng):Microchip Technology 功能描述:1K-16K Microwire Compatible Serial EEPROMs |
| 93LC56C-E/MC | 制造商:MICROCHIP 制造商全稱(chēng):Microchip Technology 功能描述:1K-16K Microwire Compatible Serial EEPROMs |
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