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參數(shù)資料
| 型號： | 935267052005 |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 消費家電 |
| 英文描述： | SPECIALTY CONSUMER CIRCUIT, UUC |
| 封裝： | WAFER |
| 文件頁數(shù)： | 8/24頁 |
| 文件大?。?/td> | 341K |
| 代理商： | 935267052005 |
January 2005
Page 16 of 24
Public
12 Handling Recommendations
12.1 Assembly
The bumped ICODE1 IC enables flip chip assembly using ACF (anisotropic conductive film),
ACP (anisotropic conductive paste) and conductive glue.
13 Coil Specification
The ICODE1 Label IC has to be connected at pads LA, LB to a coil characterised by its electrical
parameters according to Philips application note ‘ICODE Label IC, Coil Design Guide’.
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