參數(shù)資料
型號： 935267052005
廠商： NXP SEMICONDUCTORS
元件分類： 消費家電
英文描述： SPECIALTY CONSUMER CIRCUIT, UUC
封裝： WAFER
文件頁數(shù)： 12/24頁
文件大小： 341K
代理商： 935267052005
January 2005
Page 2 of 24
Public
1 Contents
1
CONTENTS
2
DEFINITIONS
4
2.1
Life Support Applications .................................................................................................... 4
2.2
Abbreviations ........................................................................................................................ 4
3
SCOPE
5
4
ORDERING INFORMATION
5
FUNCTIONAL DESCRIPTION
6
5.1
Basic Features ....................................................................................................................... 6
5.2
Block Diagram of the IC....................................................................................................... 6
5.3
Memory Organisation........................................................................................................... 7
5.3.1
Serial Number .................................................................................................................. 7
5.3.2
Write Access Conditions .................................................................................................. 7
5.3.3
Special Functions (EAS/QUIET)..................................................................................... 8
5.3.4
Family Code and Application Identifier........................................................................... 8
5.3.5
Configuration of delivered ICs......................................................................................... 9
6
BUMP SPECIFICATIONS
10
7
MECHANICAL DIE SPECIFICATIONS
11
8
MECHANICAL WAFER SPECIFICATIONS
12
8.1
Wafer Status ........................................................................................................................ 12
8.2
Backside Treatment ............................................................................................................ 12
9
DOCUMENTATION
13
9.1
Delivery Documentation..................................................................................................... 13
9.2
Fail-Die Identification......................................................................................................... 13
9.2.1
Ink Dot Specification..................................................................................................... 13
9.2.2
Wafer Mapping............................................................................................................... 13
10
QUALITY ASSURANCE
14
10.1
Electrical Acceptance Test ............................................................................................. 14
10.2
Visual Inspection............................................................................................................. 14
10.2.1
After Wafer Final Test ................................................................................................ 14
10.2.2
After Sawing (Film Frame Carrier) ............................................................................ 14
11
PACKING
15
11.1
Storage Recommendations ............................................................................................. 15
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