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參數(shù)資料
| 型號： | 935267052005 |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 消費家電 |
| 英文描述： | SPECIALTY CONSUMER CIRCUIT, UUC |
| 封裝： | WAFER |
| 文件頁數(shù)： | 7/24頁 |
| 文件大?。?/td> | 341K |
| 代理商： | 935267052005 |
January 2005
Page 15 of 24
Public
11 Packing
The packing for shipment of wafers has to protect the wafers against shock, severe impact, dust and
electrostatic discharge. The packing of sawn wafers is done according to Philips ‘General
Specification for 6” Wafer’.
11.1 Storage Recommendations
Sawn wafers should be kept in their original packing whilst in storage.
Recommended storage conditions:
Temperature:
15 ... 25 °C
Climate atmosphere:
40 ... 60 % r.h.
Duration of storage:
max. 6 months
Deviating requirements have to be arranged between customer and Philips Semiconductors.
11.2 Form of Delivery
11.2.1 Packing of Sawn Wafers
Delivery form:
Film Frame Carrier (standard Philips carrier type P7)
Foil thickness:
0.55 ... 0.85 mm
Foil material:
sticky foil
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