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參數(shù)資料
| 型號(hào)： | 74F807 |
| 廠商： | NXP Semiconductors N.V. |
| 英文描述： | Octal shift/count registered transceiver with adder and parity 3.State |
| 中文描述： | 八進(jìn)制移位/罪名加法器和奇偶3.State登記收發(fā)器 |
| 文件頁(yè)數(shù)： | 5/8頁(yè) |
| 文件大?。?/td> | 72K |
| 代理商： | 74F807 |
Philips Semiconductors FAST Products
Product specification
FAST 74F807
Octal shift/count registered transceiver
with adder and parity (3–State)
June 18, 1991
5
RECOMMENDED OPERATING CONDITIONS
LIMITS
SYMBOL
PARAMETER
MIN
NOM
MAX
UNIT
V
CC
V
IH
V
IL
I
Ik
I
OH
I
OL
Supply voltage
4.5
5.0
5.5
V
High–level input voltage
2.0
V
Low–level input voltage
0.8
V
Input clamp current
–18
mA
High–level output current
–3
mA
Low–level output current
24
mA
°
C
T
amb
Operating free air temperature
range
0
+70
DC ELECTRICAL CHARACTERISTICS
(Over recommended operating free-air temperature range unless otherwise noted.)
SYMBOL
PARAMETER
TEST
LIMITS
TYP
2
UNIT
CONDITIONS
1
MIN
MAX
V
OH
High-level output voltage
V
CC
= MIN, V
IL
= MAX,
±
10%V
CC
2.4
V
V
IH
= MIN, I
OH
= MAX
±
5%V
CC
2.7
3.4
V
V
OL
Low-level output voltage
V
CC
= MIN, V
IL
= MAX,
V
IH
= MIN, I
OL
= MAX
V
CC
= MIN, I
I
= I
IK
V
CC
= MAX, V
I
= 7.0V
V
CC
= MAX, V
I
= 2.7V
V
CC
= MAX, V
I
= 0.5V
±
10%V
CC
±
5%V
CC
0.35
0.50
V
0.35
0.50
V
V
IK
I
I
I
IH
I
IL
Input clamp voltage
–0.73
-1.2
V
μ
A
μ
A
μ
A
Input current at maximum input voltage
100
High–level input current
20
Low–level input current
–20
I
OZH
+ I
IH
Off–state output current,
high–level voltage applied
An, Bn
V
CC
= MAX, V
O
= 2.7V
50
μ
A
I
OZL
+ I
IL
Off–state output current,
low–level voltage applied
V
CC
= MAX, V
O
= 0.5V
–50
μ
A
I
OS
Short–circuit output current
3
V
CC
= MAX
-60
-150
mA
I
CC
Supply current (total)
V
CC
= MAX
155
210
mA
Notes to DC electrical characteristics
1. For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions for the applicable type.
2. All typical values are at V
CC
= 5V, T
amb
= 25
°
C.
3. Not more than one output should be shorted at a time. For testing I
OS
, the use of high-speed test apparatus and/or sample-and-hold
techniques are preferable in order to minimize internal heating and more accurately reflect operational values. Otherwise, prolonged shorting
of a high output may raise the chip temperature well above normal and thereby cause invalid readings in other parameter tests. In any
sequence of parameter tests, I
OS
tests should be performed last.
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