參數(shù)資料
型號(hào): 70V3319S133BCGI
廠商: INTEGRATED DEVICE TECHNOLOGY INC
元件分類: SRAM
英文描述: 256K X 18 DUAL-PORT SRAM, 4.2 ns, CBGA256
封裝: 17 X 17 MM X 1.4 MM, 1 MM PITCH, GREEN, BGA-256
文件頁數(shù): 5/23頁
文件大小: 222K
代理商: 70V3319S133BCGI
6.42
IDT70V3319/99S
High-Speed 3.3V 256/128K x 18 Dual-Port Synchronous Static RAM
Industrial and Commercial Temperature Ranges
13
tSC
tHC
CE0(B1)
ADDRESS(B1)
A0
A1
A2
A3
A4
A5
tSA
tHA
CLK
Q0
Q1
Q3
DATAOUT(B1)
tCH2
tCL2
tCYC2
ADDRESS(B2)
A0
A1
A2
A3
A4
A5
tSA
tHA
CE0(B2)
DATAOUT(B2)
Q2
Q4
tCD2
tCKHZ
tCD2
tCKLZ
tDC
tCKHZ
tCD2
tCKLZ
tSC
tHC
tCKHZ
tCKLZ
tCD2
A6
tDC
tSC
tHC
tSC
tHC
5623 drw 08
Timing Waveform of a Multi-Device Pipelined Read(1,2)
NOTES:
1. B1 Represents Device #1; B2 Represents Device #2. Each Device consists of one IDT70V3319/99 for this waveform,
and are setup for depth expansion in this example. ADDRESS(B1) = ADDRESS(B2) in this situation.
2.
UB, LB, OE, and ADS = VIL; CE1(B1), CE1(B2), R/W, CNTEN, and REPEAT = VIH.
Timing Waveform of a Multi-Device Flow-Through Read(1,2)
tSC
tHC
CE0(B1)
ADDRESS(B1)
A0
A1
A2
A3
A4
A5
tSA
tHA
CLK
5623 drw 09
D0
D3
tCD1
tCKLZ
tCKHZ
(1)
D1
DATAOUT(B1)
tCH1
tCL1
tCYC1
(1)
ADDRESS(B2)
A0
A1
A2
A3
A4
A5
tSA
tHA
CE0(B2)
DATAOUT(B2)
D2
D4
tCD1
tCKHZ
tDC
tCD1
tCKLZ
tSC
tHC
(1)
tCKHZ
(1)
tCKLZ
(1)
tCD1
A6
tDC
tSC
tHC
tSC
tHC
D5
tCD1
tCKLZ
(1)
tCKHZ
(1)
相關(guān)PDF資料
PDF描述
70V9389L9PRFI8 64K X 18 DUAL-PORT SRAM, 20 ns, PQFP128
IDT70V9289L9PRF8 64K X 16 DUAL-PORT SRAM, 20 ns, PQFP128
710026-3 25 mm2, COPPER ALLOY, TIN FINISH, WIRE TERMINAL
710027-5 35 mm2, COPPER ALLOY, TIN FINISH, WIRE TERMINAL
710027-2 35 mm2, COPPER ALLOY, TIN FINISH, WIRE TERMINAL
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
70V3319S133BCI 功能描述:靜態(tài)隨機(jī)存取存儲(chǔ)器 256Kx18 STD-PWR 3.3V SYNC DUAL-PORT RAM RoHS:否 制造商:Cypress Semiconductor 存儲(chǔ)容量:16 Mbit 組織:1 M x 16 訪問時(shí)間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray
70V3319S133BCI8 制造商:Integrated Device Technology Inc 功能描述:SRAM Chip Sync Dual 3.3V 4.5M-Bit 256K x 18 15ns/4.2ns 256-Pin CABGA T/R 制造商:Integrated Device Technology Inc 功能描述:SRAM SYNC DUAL 3.3V 4MBIT 256KX18 15NS/4.2NS 256BGA - Tape and Reel 制造商:Integrated Device Technology Inc 功能描述:256Kx18 STD-PWR 3.3V SYNC DUAL-PORT RAM
70V3319S133BF 功能描述:靜態(tài)隨機(jī)存取存儲(chǔ)器 256Kx18 STD-PWR 3.3V SYNC DUAL-PORT RAM RoHS:否 制造商:Cypress Semiconductor 存儲(chǔ)容量:16 Mbit 組織:1 M x 16 訪問時(shí)間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray
70V3319S133BF8 制造商:Integrated Device Technology Inc 功能描述:SRAM Chip Sync Dual 3.3V 4.5M-Bit 256K x 18 15ns/4.2ns 208-Pin CABGA T/R 制造商:Integrated Device Technology Inc 功能描述:SRAM SYNC DUAL 3.3V 4MBIT 256KX18 15NS/4.2NS 208CABGA - Tape and Reel 制造商:Integrated Device Technology Inc 功能描述:256Kx18 STD-PWR 3.3V SYNC DUAL-PORT RAM
70V3319S133BFI 制造商:Integrated Device Technology Inc 功能描述:SRAM Chip Sync Dual 3.3V 4.5M-Bit 256K x 18 15ns/4.2ns 208-Pin CABGA 制造商:Integrated Device Technology Inc 功能描述:SRAM Chip Sync Dual 3.3V 4.5M-Bit 256K x 18 15ns/4.2ns 208-Pin CABGA Tray 制造商:Integrated Device Technology Inc 功能描述:SRAM SYNC DUAL 3.3V 4MBIT 256KX18 15NS/4.2NS 208CABGA - Rail/Tube 制造商:Integrated Device Technology Inc 功能描述:256Kx18 STD-PWR 3.3V SYNC DUAL-PORT RAM