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參數(shù)資料
| 型號： | 5962-9318001MRX |
| 廠商： | MAXIM INTEGRATED PRODUCTS INC |
| 元件分類： | 多路復(fù)用及模擬開關(guān) |
| 英文描述： | QUAD 1-CHANNEL, SGL POLE DOUBLE THROW SWITCH, CDIP20 |
| 封裝： | CERAMIC, DIP-20 |
| 文件頁數(shù)： | 12/19頁 |
| 文件大小： | 3138K |
| 代理商： | 5962-9318001MRX |
2
Maxim Integrated
Differential Input DirectDrive
Line Drivers/Headphone Amplifiers
MAX97220A–MAX97220E
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
(All voltages referenced to PGND.)
SVDD, SVDD2, and PVDD ......................................-0.3V to +6V
PVSS and BIAS .......................................................-6V to +0.3V
SGND ...................................................................-0.3V to +0.3V
INL-, INL+, INR-, and INR+ (A, B, and E)...-VSVDD/2 to +VSVDD/2
INL-, INL+, INR-,
and INR+ (C and D) ....... (-0.75 x VSVDD) to (+0.75 x VSVDD)
OUTL and OUTR..................................................-4.5V to +4.5V
SHDN.......................................................................-0.3V to +6V
C1P........................................................-0.3V to (VPVDD + 0.3V)
C1N ....................................................... (VPVSS - 0.3V) to +0.3V
OUT_ Short Circuit to PGND.....................................Continuous
OUT_ Short Circuit to PVDD......................................Continuous
Short Circuit Between OUTL and OUTR...................Continuous
Continuous Current Into/Out of All Pins .............................20mA
Continuous Power Dissipation (TA = +70NC) (Multilayer Board)
TQFN (derate 20.8mW/NC above +70NC)...............1666.7mW
Junction Temperature .....................................................+150NC
Operating Temperature Range.......................... -40NC to +85NC
Storage Temperature Range............................ -65NC to +150NC
Lead Temperature (soldering, 10s) ................................+300NC
Soldering Temperature (reflow) ......................................+260NC
ELECTRICAL CHARACTERISTICS
(VPVDD = VSVDD = VSVDD2 = 5V, VPGND = VSGND = 0V, CBIAS = 0.1F, C1 = C2 = 1F, RIN = 20kω, RF = 20kω (MAX97220A/
MAX97220B/MAX97220E), typical values tested at TA = +25°C, unless otherwise noted.) (Notes 2 and 3)
ABSOLUTE MAXIMUM RATINGS
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-lay-
er board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
TQFN
Junction-to-Ambient Thermal Resistance (
qJA) ..........48°C/W
Junction-to-Case Thermal Resistance (
qJC) .................7°C/W
PACKAGE THERMAL CHARACTERISTICS (Note 1)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
GENERAL
Supply Voltage Range
PVDD,
SVDD_
Guaranteed by PSRR test
2.5
5.5
V
Quiescent Supply Current
IPVDD
No load, TA = +25NC A version
5.5
7
mA
No load, TA = +25NC B/C/D/E versions
5
9
No load, VPVDD = VSVDD_ = 3.3V
5
Undervoltage Lockout
UVLO
PVDD falling
2.35
V
Shutdown Supply Current
IPVDD_SD SHDN = 0, TA = +25NC
1
10
F
A
Turn-On Time
tON
Shutdown to full operation
time
A/C/E versions
4.8
5.5
6.3
ms
B/D versions
117
130
143
AMPLIFIERS
Input Resistance
RIN
C/D versions only
7.4
10
12.7
kI
Output Signal Attenuation in
Shutdown
VSHDN = 0V,
RL = 10kW
A/B/E versions
76
dB
C/D versions
71
Gain
AV
C/D versions only
5.5
6
6.5
dB
Output Offset Voltage
VOS
Unity gain, TA = +25NC
350
F
V
Input Common-Mode Voltage
Range
VCM
Voltage at IN+ and IN-
A/B/E versions
-0.5 x
VPVDD
+0.5 x
VPVDD
V
C/D versions
-0.75 x
VPVDD
+0.75 x
VPVDD
Maximum Differential Input Signal
VDIFF
(Note 4)
PVDD
VP
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