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參數(shù)資料
| 型號： | 5962-0720701VXC |
| 廠商： | TEXAS INSTRUMENTS INC |
| 元件分類： | ADC |
| 英文描述： | 1-CH 13-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, CQFP84 |
| 封裝： | CERAMIC, QFP-84 |
| 文件頁數(shù)： | 2/22頁 |
| 文件大?。?/td> | 706K |
| 代理商： | 5962-0720701VXC |
www.ti.com
THERMAL CHARACTERISTICS
THERMAL NOTES
ADS5444-SP
SGLS391 – MARCH 2008
TERMINAL FUNCTIONS (continued)
TERMINAL
DESCRIPTION
NAME
NO.
D7–D11, D7–D11
71–80
LVDS digital output pairs
D12, D12
81, 82
LVDS digital output pair, most-significant bit (MSB)
DRY, DRY
83, 84
Data ready LVDS output pair
NC
5, 6, 31, 35, 46–51
No connect
PARAMETER
TEST CONDITIONS
TYP
UNIT
RθJA
Junction-to-free-air thermal resistance
Board mounted, per JESD 51-5 methodology
21.813
°C/W
RθJC
Junction-to-case thermal resistance
MIL-STD-883 Test Method 1012
0.849
°C/W
This CQFP package has built in vias that electrically and thermally connect the bottom of the die to a pad on the
bottom of the package. To efficiently remove heat and provide a low-impedance ground path, a thermal land is
required on the surface of the PCB directly underneath the body of the package. During normal surface mount
flow solder operations, the heat pad on the underside of the package is soldered to this thermal land creating an
efficient thermal path. Normally, the PCB thermal land has a number of thermal vias within it that provide a
thermal path to internal copper areas (or to the opposite side of the PCB) that provide for more efficient heat
removal. TI typically recommends an 11,9-mm2 board-mount thermal pad. This allows maximum area for thermal
dissipation, while keeping leads away from the pad area to prevent solder bridging. A sufficient quantity of
thermal/electrical vias must be included to keep the device within recommended operating conditions. This pad
must be electrically at ground potential.
10
Copyright 2008, Texas Instruments Incorporated
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