
CN8236
16.0 Electrical and Mechanical Specifications
ATM ServiceSAR Plus with xBR Traffic Management
16.4 Mechanical Specifications
28236-DSH-001-A
Mindspeed Technologies
16-23
Figure 16-15. 388-Pin Ball Grid Array Package (BGA)
35.000 ± .100
30.000 ± .050
35.
000
±
.100
3
0
.00
0
±
.05
0
1.70 R
TYP 4 PL
PIN A1
TRIANGLE
(UNDERSIDE)
OPTIONAL
45 CHAMFER
TYP 4 PL
TOP VIEW
15
2.220 ± .220 BEFORE REFLOW
1.100 ± .050
.520 ± .070
SEATING PLANE
.150 MAX
0.600 ± .100 BEFORE REFLOW
SIDE VIEW
2.100 REF AFTER REFLOW
0.480 REF AFTER REFLOW
1.270 TYP
15.875
31.750 BSC
31.
750
B
S
C
1
.27
0
T
Y
P
15.
875
A
26
25
24
23
22
21
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4 3
2
1
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
AC
AD
AE
AF
BOTTOM VIEW
PIN A1
TRIANGLE
0.75 ± 0.15 DIA
NOTES:
- ALL DIMENSIONS ARE IN MILLIMETERS (MM).
- REFLOW APPLIES TO SOLDERING TO HOST
PC BOARD.
- REF: GP00-D353
- THERMAL BALLS IN CENTER CONNECT
TO GROUND.
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