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參數(shù)資料
| 型號(hào)： | 24FC256 |
| 英文描述： | 24AA256/LC256/FC256 Datasheet |
| 中文描述： | 24AA256/LC256/FC256數(shù)據(jù)表 |
| 文件頁數(shù)： | 25/28頁 |
| 文件大小： | 449K |
| 代理商： | 24FC256 |
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2003 Microchip Technology Inc.
DS21203L-page 25
24AA256/24LC256/24FC256
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
Sales and Support
Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences
and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of
the following:
1.
Your local Microchip sales office
2.
The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277
3.
The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
New Customer Notification System
Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
PART NO.
X
/XX
Package
Temperature
Range
Device
Device:
24AA256:
256 Kbit 1.8V I
2
C Serial
EEPROM
256 Kbit 1.8V I
2
C Serial
EEPROM Tape and Reel)
256 Kbit 2.5V I
2
C Serial
EEPROM
256 Kbit 2.5V I
2
C Serial
EEPROM Tape and Reel)
256 Kbit 1 MHz I
2
C Serial
EEPROM
256 Kbit 1 MHz I
2
C Serial
EEPROM Tape and Reel)
24AA256T:
24LC256:
24LC256T:
24FC256:
24FC256T:
Temperature
Range:
I
E
=
=
-40
°
C to +85
°
C
-40
°
C to +125
°
C
Package:
P
SN
SM
ST
ST14 = Plastic TSSOP (4.4 mm), 14-lead
MF
= Dual, Flat, No Lead (DFN)(6x5 mm
body), 8-lead
MS
= Plastic Micro Small Outline (MSOP),
8-lead
Blank= Standard 63%/37% Sn/Pb
G
= Pb-free (Pure Matte Sn)
= Plastic DIP (300 mil body), 8-lead
= Plastic SOIC (150 mil body), 8-lead
= Plastic SOIC (208 mil body), 8-lead
= Plastic TSSOP (4.4 mm), 8-lead
Lead Finish
Examples:
a)
24AA256-I/P:
1.8V, PDIP package.
b)
24AA256T-I/SN: Tape and Reel,
Industrial Temp., 1.8V, SOIC
package.
c)
24AA256-I/ST:
1.8V, TSSOP package.
d)
24AA256-I/MS:
1.8V, MSOP package.
e)
24LC256-E/P:
2.5V, PDIP package.
f)
24LC256-I/SN:
2.5V, SOIC package.
g)
24LC256T-I/SN: Tape and Reel,
Industrial Temp., 2.5V, SOIC
package.
h)
24LC256-I/MS:
2.5V, MSOP package.
i)
24FC256-I/P:
2.5V, High Speed, PDIP package.
j)
24FC256-I/SN:
2.5V, High Speed, SOIC package.
k)
24FC256T-I/SN: Tape and Reel,
Industrial Temp, 2.5V, High Speed,
SOIC package
l)
24LC256T-I/STG:Industrial Temp,
2.5V, TSSOP package, Tape & Reel,
Pb-free
m) 24LC256-I/PG:
2.5V, PDIP package, Pb-free
Industrial Temp.,
Industrial Temp.,
Industrial Temp.,
Extended Temp.,
Industrial Temp.,
Industrial Temp,
Industrial Temp,
Industrial Temp,
Industrial Temp,
X
Lead
Finish
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| 24FC32 | 32K 5.0V 1 MHz I 2 C Smart Serial EEPROM |
| 24FC32-IP | 32K 5.0V 1 MHz I 2 C Smart Serial EEPROM |
| 24FC32-ISM | 32K 5.0V 1 MHz I 2 C Smart Serial EEPROM |
| 24FC32-P | 32K 5.0V 1 MHz I 2 C Smart Serial EEPROM |
| 24FC32-SM | 32K 5.0V 1 MHz I 2 C Smart Serial EEPROM |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| 24FC256/S15K | 制造商:Microchip Technology Inc 功能描述:256K, 32K X 8, 2.5V HI-SPEED S - Gel-pak, waffle pack, wafer, diced wafer on film |
| 24FC256/W15K | 制造商:Microchip Technology Inc 功能描述:256K, 32K X 8, 2.5V HI-SPEED S - Gel-pak, waffle pack, wafer, diced wafer on film |
| 24FC256/WF15K | 制造商:Microchip Technology Inc 功能描述:256K, 32K X 8, 2.5V HI-SPEED S - Gel-pak, waffle pack, wafer, diced wafer on film |
| 24FC256E/MF | 制造商:MICROCHIP 制造商全稱:Microchip Technology 功能描述:256K I2C CMOS Serial EEPROM |
| 24FC256-E/MF | 制造商:MICROCHIP 制造商全稱:Microchip Technology 功能描述:256K I2C CMOS Serial EEPROM |
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