- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄371367 > 20N03HL (Motorola, Inc.) HDTMOS E-FET High Density Power FET DPAK for Surface Mount PDF資料下載
參數(shù)資料
| 型號(hào)： | 20N03HL |
| 廠商： | Motorola, Inc. |
| 英文描述： | HDTMOS E-FET High Density Power FET DPAK for Surface Mount |
| 中文描述： | HDTMOS電子FET的高密度功率FET DPAK封裝的表面貼裝 |
| 文件頁數(shù)： | 5/12頁 |
| 文件大小： | 250K |
| 代理商： | 20N03HL |
5
Motorola TMOS Power MOSFET Transistor Device Data
QG, TOTAL GATE CHARGE (nC)
RG, GATE RESISTANCE (Ohms)
t
V
V
Figure 8. Gate–To–Source and Drain–To–Source
Voltage versus Total Charge
1
10
100
1000
100
10
VDD = 15 V
ID = 20 A
VGS = 5.0 V
TJ = 25
°
C
tr
tf
td(on)
td(off)
Figure 9. Resistive Switching Time
Variation versus Gate Resistance
0
2
4
8
12
14
6
10
10
6
2
0
8
4
14
28
20
16
12
4
8
0
QT
Q2
VGS
ID = 20 A
TJ = 25
°
C
VDS
Q3
Q1
24
12
DRAIN–TO–SOURCE DIODE CHARACTERISTICS
The switching characteristics of a MOSFET body diode
are very important in systems using it as a freewheeling or
commutating diode. Of particular interest are the reverse re-
covery characteristics which play a major role in determining
switching losses, radiated noise, EMI and RFI.
System switching losses are largely due to the nature of
the body diode itself. The body diode is a minority carrier de-
vice, therefore it has a finite reverse recovery time, trr, due to
the storage of minority carrier charge, QRR, as shown in the
typical reverse recovery wave form of Figure 12. It is this
stored charge that, when cleared from the diode, passes
through a potential and defines an energy loss. Obviously,
repeatedly forcing the diode through reverse recovery further
increases switching losses. Therefore, one would like a
diode with short trr and low QRR specifications to minimize
these losses.
The abruptness of diode reverse recovery effects the
amount of radiated noise, voltage spikes, and current ring-
ing. The mechanisms at work are finite irremovable circuit
parasitic inductances and capacitances acted upon by high
di/dts. The diode’s negative di/dt during ta is directly con-
trolled by the device clearing the stored charge. However,
the positive di/dt during tb is an uncontrollable diode charac-
teristic and is usually the culprit that induces current ringing.
Therefore, when comparing diodes, the ratio of tb/ta serves
as a good indicator of recovery abruptness and thus gives a
comparative estimate of probable noise generated. A ratio of
1 is considered ideal and values less than 0.5 are considered
snappy.
Compared to Motorola standard cell density low voltage
MOSFETs, high cell density MOSFET diodes are faster
(shorter trr), have less stored charge and a softer reverse re-
covery characteristic. The softness advantage of the high
cell density diode means they can be forced through reverse
recovery at a higher di/dt than a standard cell MOSFET
diode without increasing the current ringing or the noise gen-
erated. In addition, power dissipation incurred from switching
the diode will be less due to the shorter recovery time and
lower switching losses.
I
VSD, SOURCE–TO–DRAIN VOLTAGE (Volts)
0.50
0.70
0.90
0
8
12
16
20
Figure 10. Diode Forward Voltage versus Current
4
0.60
0.80
VGS = 0 V
TJ = 25
°
C
1.0
0.65
0.85
0.55
0.75
0.95
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| 20N60A4 | 600V, SMPS Series N-Channel IGBTsnull |
| 20NAB06 | 3-phase bridge rectifier +braking chopper +3-phase bridge inverter |
| 20NAB12 | 3-phase bridge rectifier +braking chopper +3-phase bridge inverter |
| 20PMT03 | 10/100 Base TX Transformer Designed for general Chipsets |
| 20PMT04B | Single 10Base-T/100Base-TX Transformer Design for varied turn ratio on Tx side |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| 20N0500 | 制造商:Distributed By MCM 功能描述:Pico/Micro .281'' x .093'' |
| 20N06HDT4 | 制造商: 功能描述: 制造商:undefined 功能描述: |
| 20N1000 | 制造商:Distributed By MCM 功能描述:Pico/Micro .281'' x .093'' |
| 20N1500 | 制造商:Distributed By MCM 功能描述:Pico/Micro .281'' x .093'' |
| 20N40 | 制造商:UTC-IC 制造商全稱:UTC-IC 功能描述:400V, 23A N-CHANNEL POWER MOSFET |
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。