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參數(shù)資料
| 型號(hào)： | μPD78P078Y |
| 廠商： | NEC Corp. |
| 英文描述： | 8 Bit Single Chip Microcontrollers(8位單片微控制器) |
| 中文描述： | 8位單片機(jī)微控制器（8位單片微控制器） |
| 文件頁(yè)數(shù)： | 73/84頁(yè) |
| 文件大?。?/td> | 472K |
| 代理商： | ΜPD78P078Y |
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73
m
PD78P078Y
Soldering Method
Infrared ray reflow
Soldering Conditions
Symbol
Package peak temperature: 235°C, Reflow time: 30 seconds or
less (at 210°C or higher), Number of reflow processes: 3 or less
Package peak temperature: 215°C, Reflow time: 40 seconds or
less (at 200°C or higher), Number of reflow processes: 3 or less
Solder temperature: 260°C or below, Flow time: 10 seconds or
less, Number of flow processes: 1,
Preheating temperature: 120°C max. (package surface
temperature)
Pin temperature: 300°C or below,
Flow time: 3 seconds or less (per pin row)
IR35-00-3
VPS
VP15-00-3
Wave soldering
WS60-00-1
Partial heating
—
12. RECOMMENDED SOLDERING CONDITIONS
It is recommended that the
m
PD78P078Y be soldered under the following conditions.
For details on the recommended soldering conditions, refer to information document
“Semiconductor Device
Mounting Technology Manual” (C10535E)
.
For soldering methods and conditions other than those recommended, please contact your NEC sales
representative.
Table 12-1. Soldering Conditions for Surface Mount Devices
m
PD78P078YGF-3BA: 100-pin plastic QFP (14
￥
20 mm, resin thickness: 2.7 mm)
Cautions 1. Do not use different soldering methods together (except for partial heating method).
2. Soldering conditions have not been fixed because the
m
PD78P078YGC-8EU is still under
development.
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