13
m
PD78P078Y
CONTENTS
1.
DIFFERENCES BETWEEN THE
m
PD78P078Y AND MASK ROM VERSIONS ................... 14
2.
PIN FUNCTIONS ...................................................................................................................... 15
2.1
Pins in Normal Operating Mode ....................................................................................................... 15
2.2
Pins in PROM Programming Mode .................................................................................................. 19
2.3
Pin Input/Output Circuits and Recommended Connection of Unused Pins................................... 20
3.
MEMORY SIZE SWITCHING REGISTER (IMS) ..................................................................... 24
4.
INTERNAL EXPANSION RAM SIZE SWITCHING REGISTER (IXS) ................................... 25
5.
PROM PROGRAMMING .......................................................................................................... 26
5.1
Operating Modes .............................................................................................................................. 26
5.2
PROM Write Procedure .................................................................................................................... 28
5.3
PROM Read Procedure.................................................................................................................... 32
6.
PROGRAM ERASURE (
m
PD78P078KL-T ONLY).................................................................. 33
7.
OPAQUE FILM ON ERASURE WINDOW (
m
PD78P078YKL-T ONLY) ................................. 33
8.
ONE-TIME PROM VERSION SCREENING ............................................................................ 33
9.
ELECTRICAL SPECIFICATIONS............................................................................................ 34
10.
CHARACTERISTIC CURVES (REFERENCE VALUES)........................................................ 68
11.
PACKAGE DRAWINGS ........................................................................................................... 70
12.
RECOMMENDED SOLDERING CONDITIONS ...................................................................... 73
APPENDIX A.
DEVELOPMENT TOOLS ..................................................................................... 74
APPENDIX B.
RELATED DOCUMENTS ..................................................................................... 79