參數(shù)資料
型號(hào): XL1002
廠商: MIMIX BROADBAND INC
元件分類(lèi): 衰減器
英文描述: 20.0-36.0 GHz GaAs MMIC Low Noise Amplifier
中文描述: 20000 MHz - 36000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER
封裝: DIE-10
文件頁(yè)數(shù): 5/8頁(yè)
文件大?。?/td> 822K
代理商: XL1002
20.0-36.0 GHz GaAs MMIC
Low Noise Amplifier
Page 5 of 8
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Characteristic Data and Specifications are subject to change without notice.
2005 Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.
Mechanical Drawing
(Note: Engineering designator is 28LN3BA0050)
Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad.
Thickness: 0.115 +/- 0.010 (0.0045 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold
All DC Bond Pads are 0.100 x 0.100 (0.004 x 0.004). All RF Bond Pads are 0.100 x 0.200 (0.004 x 0.008)
Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.
Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 2.838 mg.
Bond Pad #1 (RF In)
Bond Pad #2 (V1)
Bond Pad #3 (V2)
Bond Pad #6 (RF Out)
Bias Arrangement
Bond Pad #4 (V3)
Bond Pad #5 (V4)
Bond Pad #7 (V8)
Bond Pad #8 (V7)
Bond Pad #9 (V6)
Bond Pad #10 (V5)
Bypass Capacitors
- See App Note [2]
March 2005 - Rev 01-Mar-05
L1002
RF Out
V5*
RF In
V1*
1
2
3
4
5
6
7
8
9
10
1.384
(0.055)
1.184
(0.047)
0.983
(0.039)
0.785
(0.031)
1
2
3
4
5
1.950
(0.077)
0.983
(0.039)
0.658
(0.026)
1.288
(0.051)
0.0
0.0
6
7
8
1.184
(0.047)
0.785
(0.031)
9
10
1.384
(0.055)
2.350
(0.093)
*V1 or V5 may be used, but both are not required.
RF In
RF Out
V5
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
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