參數(shù)資料
型號(hào): XCV1600E-7FG1156C
廠商: Xilinx Inc
文件頁(yè)數(shù): 186/233頁(yè)
文件大?。?/td> 0K
描述: IC FPGA 1.8V C-TEMP 1156-FBGA
產(chǎn)品變化通告: FPGA Family Discontinuation 18/Apr/2011
標(biāo)準(zhǔn)包裝: 1
系列: Virtex®-E
LAB/CLB數(shù): 7776
邏輯元件/單元數(shù): 34992
RAM 位總計(jì): 589824
輸入/輸出數(shù): 724
門數(shù): 2188742
電源電壓: 1.71 V ~ 1.89 V
安裝類型: 表面貼裝
工作溫度: 0°C ~ 85°C
封裝/外殼: 1156-BBGA
供應(yīng)商設(shè)備封裝: 1156-FBGA(35x35)
第1頁(yè)第2頁(yè)第3頁(yè)第4頁(yè)第5頁(yè)第6頁(yè)第7頁(yè)第8頁(yè)第9頁(yè)第10頁(yè)第11頁(yè)第12頁(yè)第13頁(yè)第14頁(yè)第15頁(yè)第16頁(yè)第17頁(yè)第18頁(yè)第19頁(yè)第20頁(yè)第21頁(yè)第22頁(yè)第23頁(yè)第24頁(yè)第25頁(yè)第26頁(yè)第27頁(yè)第28頁(yè)第29頁(yè)第30頁(yè)第31頁(yè)第32頁(yè)第33頁(yè)第34頁(yè)第35頁(yè)第36頁(yè)第37頁(yè)第38頁(yè)第39頁(yè)第40頁(yè)第41頁(yè)第42頁(yè)第43頁(yè)第44頁(yè)第45頁(yè)第46頁(yè)第47頁(yè)第48頁(yè)第49頁(yè)第50頁(yè)第51頁(yè)第52頁(yè)第53頁(yè)第54頁(yè)第55頁(yè)第56頁(yè)第57頁(yè)第58頁(yè)第59頁(yè)第60頁(yè)第61頁(yè)第62頁(yè)第63頁(yè)第64頁(yè)第65頁(yè)第66頁(yè)第67頁(yè)第68頁(yè)第69頁(yè)第70頁(yè)第71頁(yè)第72頁(yè)第73頁(yè)第74頁(yè)第75頁(yè)第76頁(yè)第77頁(yè)第78頁(yè)第79頁(yè)第80頁(yè)第81頁(yè)第82頁(yè)第83頁(yè)第84頁(yè)第85頁(yè)第86頁(yè)第87頁(yè)第88頁(yè)第89頁(yè)第90頁(yè)第91頁(yè)第92頁(yè)第93頁(yè)第94頁(yè)第95頁(yè)第96頁(yè)第97頁(yè)第98頁(yè)第99頁(yè)第100頁(yè)第101頁(yè)第102頁(yè)第103頁(yè)第104頁(yè)第105頁(yè)第106頁(yè)第107頁(yè)第108頁(yè)第109頁(yè)第110頁(yè)第111頁(yè)第112頁(yè)第113頁(yè)第114頁(yè)第115頁(yè)第116頁(yè)第117頁(yè)第118頁(yè)第119頁(yè)第120頁(yè)第121頁(yè)第122頁(yè)第123頁(yè)第124頁(yè)第125頁(yè)第126頁(yè)第127頁(yè)第128頁(yè)第129頁(yè)第130頁(yè)第131頁(yè)第132頁(yè)第133頁(yè)第134頁(yè)第135頁(yè)第136頁(yè)第137頁(yè)第138頁(yè)第139頁(yè)第140頁(yè)第141頁(yè)第142頁(yè)第143頁(yè)第144頁(yè)第145頁(yè)第146頁(yè)第147頁(yè)第148頁(yè)第149頁(yè)第150頁(yè)第151頁(yè)第152頁(yè)第153頁(yè)第154頁(yè)第155頁(yè)第156頁(yè)第157頁(yè)第158頁(yè)第159頁(yè)第160頁(yè)第161頁(yè)第162頁(yè)第163頁(yè)第164頁(yè)第165頁(yè)第166頁(yè)第167頁(yè)第168頁(yè)第169頁(yè)第170頁(yè)第171頁(yè)第172頁(yè)第173頁(yè)第174頁(yè)第175頁(yè)第176頁(yè)第177頁(yè)第178頁(yè)第179頁(yè)第180頁(yè)第181頁(yè)第182頁(yè)第183頁(yè)第184頁(yè)第185頁(yè)當(dāng)前第186頁(yè)第187頁(yè)第188頁(yè)第189頁(yè)第190頁(yè)第191頁(yè)第192頁(yè)第193頁(yè)第194頁(yè)第195頁(yè)第196頁(yè)第197頁(yè)第198頁(yè)第199頁(yè)第200頁(yè)第201頁(yè)第202頁(yè)第203頁(yè)第204頁(yè)第205頁(yè)第206頁(yè)第207頁(yè)第208頁(yè)第209頁(yè)第210頁(yè)第211頁(yè)第212頁(yè)第213頁(yè)第214頁(yè)第215頁(yè)第216頁(yè)第217頁(yè)第218頁(yè)第219頁(yè)第220頁(yè)第221頁(yè)第222頁(yè)第223頁(yè)第224頁(yè)第225頁(yè)第226頁(yè)第227頁(yè)第228頁(yè)第229頁(yè)第230頁(yè)第231頁(yè)第232頁(yè)第233頁(yè)
Virtex-E 1.8 V Field Programmable Gate Arrays
R
Module 2 of 4
DS022-2 (v3.0) March 21, 2014
50
Production Product Specification
— OBSOLETE — OBSOLETE — OBSOLETE — OBSOLETE —
Creating LVDS Output 3-State Buffers
LVDS output 3-state buffers can be placed in a wide number
of IOB locations. The exact locations are dependent on the
package used. The Virtex-E package information lists the
possible locations as IO_L#P for the P-side and IO_L#N for
the N-side, where # is the pair number.
HDL Instantiation
Both output 3-state buffers are required to be instantiated in
the design and placed on the correct IO_L#P and IO_L#N
locations. The IOB must have the same net source the fol-
lowing pins, clock (C), set/reset (SR), 3-state (T), 3-state
clock enable (TCE), output (O), output clock enable (OCE).
In addition, the output (O) pins must be inverted with
respect to each other, and if output registers are used, the
INIT states must be opposite values (one High and one
Low). If 3-state registers are used, they must be initialized to
the same state. Failure to follow these rules leads to DRC
errors in the software.
VHDL Instantiation
data0_p:
OBUFT_LVDS port map
(I=>data_int(0), T=>data_tri,
O=>data_p(0));
data0_inv: INV port map
(I=>data_int(0), O=>data_n_int(0));
data0_n:
OBUFT_LVDS port map
(I=>data_n_int(0), T=>data_tri,
O=>data_n(0));
Verilog Instantiation
OBUFT_LVDS data0_p
(.I(data_int[0]),
.T(data_tri), .O(data_p[0]));
INV
data0_inv (.I(data_int[0],
.O(data_n_int[0]);
OBUFT_LVDS data0_n
(.I(data_n_int[0]),
.T(data_tri), .O(data_n[0]));
Location Constraints
All LVDS buffers must be explicitly placed on a device. For
the output buffers this can be done with the following con-
straint in the .ucf or .ncf file.
NET data_p<0> LOC = D28; # IO_L0P
NET data_n<0> LOC = B29; # IO_L0N
Synchronous vs. Asynchronous 3-State Outputs
If the outputs are synchronous (registered in the IOB), then
any IO_L#P|N pair can be used. If the outputs are asynchro-
nous (no output register), then they must use one of the
pairs that are part of the same IOB group at the end of a
ROW or COLUMN in the device. This applies for either the
3-state pin or the data out pin.
LVDS pairs that can be used as asynchronous outputs are
listed in the Virtex-E pinout tables. Some pairs are marked
as “asynchronous capable” for all devices in that package,
and others are marked as available only for that device in
the package. If the device size might be changed at some
point in the product lifetime, then only the common pairs for
all packages should be used.
Adding Output and 3-State Registers
All LVDS buffers can have an output register in the IOB. The
output registers must be in both the P-side and N-side IOBs.
All the normal IOB register options are available (FD, FDE,
FDC, FDCE, FDP, FDPE, FDR, FDRE, FDS, FDSE, LD,
LDE, LDC, LDCE, LDP, LDPE). The register elements can
be inferred or explicitly instantiated in the HDL code.
Special care must be taken to insure that the D pins of the
registers are inverted and that the INIT states of the regis-
ters are opposite. The 3-state (T), 3-state clock enable
(CE), clock pin (C), output clock enable (CE) and set/reset
(CLR/PRE or S/R) pins must connect to the same source.
Failure to do this leads to a DRC error in the software.
Table 43: Output Library Macros
Name
Inputs
Outputs
OBUFDS_FD_LVDS
D, C
O, OB
OBUFDS_FDE_LVDS
DD, CE, C
O, OB
OBUFDS_FDC_LVDS
D, C, CLR
O, OB
OBUFDS_FDCE_LVDS
D, CE, C, CLR
O, OB
OBUFDS_FDP_LVDS
D, C, PRE
O, OB
OBUFDS_FDPE_LVDS
D, CE, C, PRE
O, OB
OBUFDS_FDR_LVDS
D, C, R
O, OB
OBUFDS_FDRE_LVDS
D, CE, C, R
O, OB
OBUFDS_FDS_LVDS
D, C, S
O, OB
OBUFDS_FDSE_LVDS
D, CE, C, S
O, OB
OBUFDS_LD_LVDS
D, G
O, OB
OBUFDS_LDE_LVDS
D, GE, G
O, OB
OBUFDS_LDC_LVDS
D, G, CLR
O, OB
OBUFDS_LDCE_LVDS
D, GE, G, CLR
O, OB
OBUFDS_LDP_LVDS
D, G, PRE
O, OB
OBUFDS_LDPE_LVDS
D, GE, G, PRE
O, OB
相關(guān)PDF資料
PDF描述
GCB120DHBN CONN EDGECARD 240PS P/A .050 SLD
XCV812E-8BG560C IC FPGA 1.8V C-TEMP 560-MBGA
XC6VSX315T-L1FFG1156C IC FPGA VIRTEX 6 314K 1156FFGBGA
AMM31DRMI CONN EDGECARD 62POS .156 WW
XC6VSX315T-2FFG1156C IC FPGA VIRTEX 6 314K 1156FFGBGA
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
XCV1600E-7FG1156I 功能描述:IC FPGA 1.8V I-TEMP 1156-FBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場(chǎng)可編程門陣列) 系列:Virtex®-E 產(chǎn)品變化通告:XC4000(E,L) Discontinuation 01/April/2002 標(biāo)準(zhǔn)包裝:24 系列:XC4000E/X LAB/CLB數(shù):100 邏輯元件/單元數(shù):238 RAM 位總計(jì):3200 輸入/輸出數(shù):80 門數(shù):3000 電源電壓:4.5 V ~ 5.5 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:120-BCBGA 供應(yīng)商設(shè)備封裝:120-CPGA(34.55x34.55)
XCV1600E-7FG240C 制造商:XILINX 制造商全稱:XILINX 功能描述:Virtex⑩-E 1.8 V Field Programmable Gate Arrays
XCV1600E-7FG240I 制造商:XILINX 制造商全稱:XILINX 功能描述:Virtex-E 1.8 V Field Programmable Gate Arrays
XCV1600E-7FG680C 功能描述:IC FPGA 1.8V C-TEMP 680-FBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場(chǎng)可編程門陣列) 系列:Virtex®-E 產(chǎn)品變化通告:XC4000(E,L) Discontinuation 01/April/2002 標(biāo)準(zhǔn)包裝:24 系列:XC4000E/X LAB/CLB數(shù):100 邏輯元件/單元數(shù):238 RAM 位總計(jì):3200 輸入/輸出數(shù):80 門數(shù):3000 電源電壓:4.5 V ~ 5.5 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:120-BCBGA 供應(yīng)商設(shè)備封裝:120-CPGA(34.55x34.55)
XCV1600E-7FG680I 功能描述:IC FPGA 1.8V I-TEMP 680-FBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場(chǎng)可編程門陣列) 系列:Virtex®-E 產(chǎn)品變化通告:XC4000(E,L) Discontinuation 01/April/2002 標(biāo)準(zhǔn)包裝:24 系列:XC4000E/X LAB/CLB數(shù):100 邏輯元件/單元數(shù):238 RAM 位總計(jì):3200 輸入/輸出數(shù):80 門數(shù):3000 電源電壓:4.5 V ~ 5.5 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:120-BCBGA 供應(yīng)商設(shè)備封裝:120-CPGA(34.55x34.55)