DS182 (v1.1) April 1, 2011
Advance Product Specification
1
2011 Xilinx, Inc. XILINX, the Xilinx logo, Virtex, Kintex, Artix, Zynq, Spartan, ISE, and other designated brands included herein are trademarks of Xilinx in the United States and
other countries. All other trademarks are the property of their respective owners.
Kintex-7 FPGA Electrical Characteristics
Kintex-7 FPGAs are available in -3, -2, -1, and -1L speed
grades, with -3 having the highest performance. Kintex-7
FPGA DC and AC characteristics are specified in
commercial, extended, and industrial temperature ranges.
Except the operating temperature range or unless
otherwise noted, all the DC and AC electrical parameters
are the same for a particular speed grade (that is, the timing
characteristics of a -1 speed grade industrial device are the
same as for a -1 speed grade commercial device). However,
only selected speed grades and/or devices are available in
the extended or industrial temperature range.
All supply voltage and junction temperature specifications
are representative of worst-case conditions. The
parameters included are common to popular designs and
typical applications.
This Kintex-7 FPGA data sheet, part of an overall set of
documentation on the 7 series FPGAs, is available on the
All specifications are subject to change without notice.
Kintex-7 FPGA DC Characteristics
Kintex-7 FPGAs Data Sheet:
DC and Switching Characteristics
DS182 (v1.1) April 1, 2011
Advance Product Specification
Table 1: Absolute Maximum Ratings (1) Symbol
Description
Units
VCCINT
Internal supply voltage relative to GND
–0.5 to 1.1
V
For -1L devices: Internal supply voltage relative to GND
–0.5 to 1.0
V
VCCAUX
Auxiliary supply voltage relative to GND
–0.5 to 2.0
V
VCCAUX_IO
Auxiliary supply voltage relative to GND
–0.5 to 2.06
V
VCCO
Output drivers supply voltage relative to GND for 3.3V HR banks
–0.5 to 3.6
V
Output drivers supply voltage relative to GND for 1.8V HP banks
–0.5 to 2.0
V
VCCBRAM
Supply voltage for the block RAM memories
–0.5 to 1.1
V
VCCADC
XADC supply relative to GNDADC
–0.5 to 2.0
V
VCCBATT
Key memory battery backup supply
–0.5 to 2.0
V
VREF
Input reference voltage
–0.5 to 2.0
V
VREFP
XADC reference input relative to GNDADC
–0.5 to 2.0
V
3.3V or below I/O input voltage relative to GND
(3) (user and dedicated I/Os)
–0.5 to VCCO +0.5
V
1.8V or below I/O input voltage relative to GND
(3) (user and dedicated I/Os)
–0.5 to VCCO +0.5
V
VTS
Voltage applied to 3-state 1.8V or below ou
tput(3) (user and dedicated I/Os)
–0.5 to VCCO +0.5
V
TSTG
Storage temperature (ambient)
–65 to 150
°C
TSOL
Maximum soldering temperature
(4)+220
°C
Tj
+125
°C
Notes:
1.
Stresses beyond those listed under Absolute Maximum Ratings might cause permanent damage to the device. These are stress ratings only,
and functional operation of the device at these or any other conditions beyond those listed under Operating Conditions is not implied.
Exposure to Absolute Maximum Ratings conditions for extended periods of time might affect device reliability.
2.
The 3.3V and 1.8V I/O absolute maximum limit applied to DC and AC signals.
3.
For I/O operation, refer to
UG471: 7 Series FPGAs SelectIO Resources User Guide.
4.
For soldering guidelines and thermal considerations, see
UG475: 7 Series FPGA Packaging and Pinout Specification.