- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄4235 > XC6SLX150T-2FG900I (Xilinx Inc)IC FPGA SPARTAN 6 900FGGBGA PDF資料下載
參數(shù)資料
| 型號： | XC6SLX150T-2FG900I |
| 廠商： | Xilinx Inc |
| 文件頁數(shù)： | 45/89頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC FPGA SPARTAN 6 900FGGBGA |
| 標準包裝： | 27 |
| 系列： | Spartan® 6 LXT |
| LAB/CLB數(shù)： | 11519 |
| 邏輯元件/單元數(shù)： | 147443 |
| RAM 位總計： | 4939776 |
| 輸入/輸出數(shù)： | 540 |
| 電源電壓： | 1.14 V ~ 1.26 V |
| 安裝類型： | 表面貼裝 |
| 工作溫度： | -40°C ~ 100°C |
| 封裝/外殼： | 900-BBGA |
| 供應商設備封裝： | 900-FBGA |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁第35頁第36頁第37頁第38頁第39頁第40頁第41頁第42頁第43頁第44頁當前第45頁第46頁第47頁第48頁第49頁第50頁第51頁第52頁第53頁第54頁第55頁第56頁第57頁第58頁第59頁第60頁第61頁第62頁第63頁第64頁第65頁第66頁第67頁第68頁第69頁第70頁第71頁第72頁第73頁第74頁第75頁第76頁第77頁第78頁第79頁第80頁第81頁第82頁第83頁第84頁第85頁第86頁第87頁第88頁第89頁
Spartan-6 FPGA Data Sheet: DC and Switching Characteristics
DS162 (v3.0) October 17, 2011
Product Specification
5
Table 4: DC Characteristics Over Recommended Operating Conditions
Symbol
Description
Min
Typ
Max
Units
VDRINT
Data retention VCCINT voltage (below which configuration data might be lost)
0.8
–
V
VDRAUX
Data retention VCCAUX voltage (below which configuration data might be lost)
2.0
–
V
IREF
VREF leakage current per pin for commercial (C) and industrial (I) devices
–10
–
10
A
VREF leakage current per pin for expanded (Q) devices
–15
–
15
A
IL
Input or output leakage current per pin (sample-tested) for commercial (C) and industrial
(I) devices
–10
–
10
A
Input or output leakage current per pin (sample-tested) for expanded (Q) devices
–15
–
15
A
IHS
Leakage current on pins during hot
socketing with FPGA unpowered
All pins except PROGRAM_B, DONE, and
JTAG pins when HSWAPEN = 1
–20
–
20
A
PROGRAM_B, DONE, and JTAG pins, or other
pins when HSWAPEN = 0
IHS + IRPU
A
CIN(1)
Die input capacitance at the pad
–
10
pF
IRPU
Pad pull-up (when selected) @ VIN =0V, VCCO =3.3V or VCCAUX = 3.3V
200
–
500
A
Pad pull-up (when selected) @ VIN =0V, VCCO =2.5V or VCCAUX = 2.5V
120
–
350
A
Pad pull-up (when selected) @ VIN =0V, VCCO = 1.8V
60
–
200
A
Pad pull-up (when selected) @ VIN =0V, VCCO = 1.5V
40
–
150
A
Pad pull-up (when selected) @ VIN =0V, VCCO = 1.2V
12
–
100
A
IRPD
Pad pull-down (when selected) @ VIN =VCCO, VCCAUX = 3.3V
200
–
550
A
Pad pull-down (when selected) @ VIN =VCCO, VCCAUX = 2.5V
140
–
400
A
IBATT(2)
Battery supply current
–
150
nA
RDT(3)
Resistance of optional input differential termination circuit, VCCAUX =3.3V
–
100
–
RIN_TERM(5)
Thevenin equivalent resistance of programmable input termination to VCCO
(UNTUNED_SPLIT_25) for commercial (C) and industrial (I) devices
23
25
55
Thevenin equivalent resistance of programmable input termination to VCCO
(UNTUNED_SPLIT_25) for expanded (Q) devices
20
25
55
Thevenin equivalent resistance of programmable input termination to VCCO
(UNTUNED_SPLIT_50) for commercial (C) and industrial (I) devices
39
50
72
Thevenin equivalent resistance of programmable input termination to VCCO
(UNTUNED_SPLIT_50) for expanded (Q) devices
32
50
74
Thevenin equivalent resistance of programmable input termination to VCCO
(UNTUNED_SPLIT_75) for commercial (C) and industrial (I) devices
56
75
109
Thevenin equivalent resistance of programmable input termination to VCCO
(UNTUNED_SPLIT_75) for expanded (Q) devices
47
75
115
ROUT_TERM
Thevenin equivalent resistance of programmable output termination (UNTUNED_25)
11
25
52
Thevenin equivalent resistance of programmable output termination (UNTUNED_50)
21
50
96
Thevenin equivalent resistance of programmable output termination (UNTUNED_75)
29
75
145
Notes:
1.
The CIN measurement represents the die capacitance at the pad, not including the package.
2.
Maximum value specified for worst case process at 25°C. LX75, LX75T, LX100, LX100T, LX150, and LX150T only.
3.
Refer to IBIS models for RDT variation and for values at VCCAUX = 2.5V. IBIS values for RDT are valid for all temperature ranges.
4.
VCCO2 is not required for data retention. The minimum VCCO2 for power-on reset and configuration is 1.65V.
5.
Termination resistance to a VCCO/2 level.
相關PDF資料 |
PDF描述 |
|---|---|
| GCB105DHBT | CONN EDGECARD 210PS R/A .050 SLD |
| FMC19DRAN-S734 | CONN EDGECARD 38POS .100 R/A SLD |
| FMC19DRAH-S734 | CONN EDGECARD 38POS .100 R/A SLD |
| XC6SLX150T-2FGG900I | IC FPGA SPARTAN 6 147K 900FGGBGA |
| RMC17DTES | CONN EDGECARD 34POS .100 EYELET |
相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| XC6SLX150T-2FGG484C | 功能描述:IC FPGA SPARTAN 6 147K 484FGGBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:Spartan® 6 LXT 產(chǎn)品變化通告:Step Intro and Pkg Change 11/March/2008 標準包裝:1 系列:Virtex®-5 SXT LAB/CLB數(shù):4080 邏輯元件/單元數(shù):52224 RAM 位總計:4866048 輸入/輸出數(shù):480 門數(shù):- 電源電壓:0.95 V ~ 1.05 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:1136-BBGA，F(xiàn)CBGA 供應商設備封裝:1136-FCBGA 配用:568-5088-ND - BOARD DEMO DAC1408D750122-1796-ND - EVALUATION PLATFORM VIRTEX-5 |
| XC6SLX150T-2FGG484CES9953 | 制造商:Xilinx 功能描述:XLXXC6SLX150T-2FGG484CES9953 SPARTAN6LXT |
| XC6SLX150T-2FGG484I | 功能描述:IC FPGA SPARTAN 6 147K 484FGGBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:Spartan® 6 LXT 產(chǎn)品變化通告:Step Intro and Pkg Change 11/March/2008 標準包裝:1 系列:Virtex®-5 SXT LAB/CLB數(shù):4080 邏輯元件/單元數(shù):52224 RAM 位總計:4866048 輸入/輸出數(shù):480 門數(shù):- 電源電壓:0.95 V ~ 1.05 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:1136-BBGA，F(xiàn)CBGA 供應商設備封裝:1136-FCBGA 配用:568-5088-ND - BOARD DEMO DAC1408D750122-1796-ND - EVALUATION PLATFORM VIRTEX-5 |
| XC6SLX150T-2FGG676C | 功能描述:IC FPGA SPARTAN 6 147K 676FGGBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:Spartan® 6 LXT 產(chǎn)品變化通告:Step Intro and Pkg Change 11/March/2008 標準包裝:1 系列:Virtex®-5 SXT LAB/CLB數(shù):4080 邏輯元件/單元數(shù):52224 RAM 位總計:4866048 輸入/輸出數(shù):480 門數(shù):- 電源電壓:0.95 V ~ 1.05 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:1136-BBGA，F(xiàn)CBGA 供應商設備封裝:1136-FCBGA 配用:568-5088-ND - BOARD DEMO DAC1408D750122-1796-ND - EVALUATION PLATFORM VIRTEX-5 |
| XC6SLX150T-2FGG676CES9981 | 制造商:Xilinx 功能描述: |
發(fā)布緊急采購，3分鐘左右您將得到回復。