參數(shù)資料
型號: XC5VLX110-1FF1760I
廠商: Xilinx Inc
文件頁數(shù): 86/91頁
文件大?。?/td> 0K
描述: IC FPGA VIRTEX-5 110K 1760FBGA
標(biāo)準(zhǔn)包裝: 1
系列: Virtex®-5 LX
LAB/CLB數(shù): 8640
邏輯元件/單元數(shù): 110592
RAM 位總計(jì): 4718592
輸入/輸出數(shù): 800
電源電壓: 0.95 V ~ 1.05 V
安裝類型: 表面貼裝
工作溫度: -40°C ~ 100°C
封裝/外殼: 1760-BBGA,F(xiàn)CBGA
供應(yīng)商設(shè)備封裝: 1760-FCBGA
配用: 568-5088-ND - BOARD DEMO DAC1408D750
HW-V5-ML523-UNI-G-ND - EVALUATION PLATFORM VIRTEX-5
HW-AFX-FF1760-500-G-ND - BOARD DEV VIRTEX 5 FF1760
Virtex-5 FPGA Data Sheet: DC and Switching Characteristics
DS202 (v5.3) May 5, 2010
Product Specification
87
02/02/07
3.0
Added XC5VSX35T, XC5VSX50T, and SX5VSX95T devices to appropriate tables.
Revised the IRPU values in Table 3, page 2.
Revised the ICCAUXQ values in Table 4, page 3.
Added values to Table 5, page 6.
Minor added notes and changed descriptions in Table 25, page 13 and Table 26, page 13.
Revised the SFI-4.1 (SDR LVDS Interface) -1 values in Table 53, page 29.
Revised gain error, bipolar gain error, and event conversion time in Table51, page26
Changed the design software version that matches this data sheet above Table 54 on page 30.
In Switching Characteristics, the following values are revised:
LVCMOS25, Fast, 12 mA in Table 56, page 32.
Setup and Hold and TICKQ in Table 60, page 40.
Sequential delay values in Table 63, page 43.
TCXB, TCEO, and TDICK in Table 65, page 44.
TRCKO_DO, TRCKO_POINTERS, TRCKO_ECCR, TRCKO_ECC, TRCCK_ADDR, TRDCK_DI, TRDCK_DI_ECC,
TRCCK_WREN, and TRCO_FLAGS in Table 68, page 47.
TDSPDCK_CC, TDSPCCK_{RSTAA, RSTBB}, TDSPCKO_{PP, CRYOUTP}, FMAX_MULT_NOMREG and
FMAX_MULT_NOMREG_PATDET in Table 69, page 48.
TBCCKO_O, and TBGCKO_O in Table 71, page 53.
TBUFIOCKO_O and FMAX in Table 72, page 53.
TBRCKO_O and TBRCKO_O_BYP in Table 73, page 54.
Parameters in Table 74, page 55 including notes.
Revised values in Table 84, Table 85, and Table 86.
Clarified description in Table 91, page 69.
Revised values in Table 91, Table 92, and Table 93.
Removed duplicate TBUFR_MAX_FREQ and TBUFIO_MAX_FREQ from Table 98.
Revised values in Table 101, page 85.
Date
Version
Revision
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XC5VLX110-1FF676C 功能描述:IC FPGA VIRTEX-5 110K 676FBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:Virtex®-5 LX 產(chǎn)品變化通告:Step Intro and Pkg Change 11/March/2008 標(biāo)準(zhǔn)包裝:1 系列:Virtex®-5 SXT LAB/CLB數(shù):4080 邏輯元件/單元數(shù):52224 RAM 位總計(jì):4866048 輸入/輸出數(shù):480 門數(shù):- 電源電壓:0.95 V ~ 1.05 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:1136-BBGA,F(xiàn)CBGA 供應(yīng)商設(shè)備封裝:1136-FCBGA 配用:568-5088-ND - BOARD DEMO DAC1408D750122-1796-ND - EVALUATION PLATFORM VIRTEX-5
XC5VLX110-1FF676CES 制造商:Xilinx 功能描述:
XC5VLX110-1FF676I 功能描述:IC FPGA VIRTEX-5 110K 676FBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:Virtex®-5 LX 產(chǎn)品變化通告:XC4000(E,L) Discontinuation 01/April/2002 標(biāo)準(zhǔn)包裝:24 系列:XC4000E/X LAB/CLB數(shù):100 邏輯元件/單元數(shù):238 RAM 位總計(jì):3200 輸入/輸出數(shù):80 門數(shù):3000 電源電壓:4.5 V ~ 5.5 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:120-BCBGA 供應(yīng)商設(shè)備封裝:120-CPGA(34.55x34.55)
XC5VLX110-1FFG1153C 功能描述:IC FPGA VIRTEX-5 110K 1153FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:Virtex®-5 LX 產(chǎn)品變化通告:Step Intro and Pkg Change 11/March/2008 標(biāo)準(zhǔn)包裝:1 系列:Virtex®-5 SXT LAB/CLB數(shù):4080 邏輯元件/單元數(shù):52224 RAM 位總計(jì):4866048 輸入/輸出數(shù):480 門數(shù):- 電源電壓:0.95 V ~ 1.05 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:1136-BBGA,F(xiàn)CBGA 供應(yīng)商設(shè)備封裝:1136-FCBGA 配用:568-5088-ND - BOARD DEMO DAC1408D750122-1796-ND - EVALUATION PLATFORM VIRTEX-5
XC5VLX110-1FFG1153CES 功能描述:IC FPGA VIRTEX5 ES 110K 1153FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:Virtex®-5 LX 標(biāo)準(zhǔn)包裝:1 系列:Kintex-7 LAB/CLB數(shù):25475 邏輯元件/單元數(shù):326080 RAM 位總計(jì):16404480 輸入/輸出數(shù):350 門數(shù):- 電源電壓:0.97 V ~ 1.03 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:900-BBGA,F(xiàn)CBGA 供應(yīng)商設(shè)備封裝:900-FCBGA(31x31) 其它名稱:122-1789