參數(shù)資料
型號: XC2S200-6PQ208C
廠商: Xilinx Inc
文件頁數(shù): 58/99頁
文件大?。?/td> 0K
描述: IC FPGA 2.5V C-TEMP 208-PQFP
標(biāo)準(zhǔn)包裝: 24
系列: Spartan®-II
LAB/CLB數(shù): 1176
邏輯元件/單元數(shù): 5292
RAM 位總計(jì): 57344
輸入/輸出數(shù): 140
門數(shù): 200000
電源電壓: 2.375 V ~ 2.625 V
安裝類型: 表面貼裝
工作溫度: 0°C ~ 85°C
封裝/外殼: 208-BFQFP
供應(yīng)商設(shè)備封裝: 208-PQFP(28x28)
Spartan-II FPGA Family: DC and Switching Characteristics
DS001-3 (v2.8) June 13, 2008
Module 3 of 4
Product Specification
61
R
Clock Distribution Guidelines(1)
Clock Distribution Switching Characteristics
TGPIO is specified for LVTTL levels. For other standards, adjust TGPIO with the values shown in "I/O Standard Global Clock
I/O Standard Global Clock Input Adjustments
Delays associated with a global clock input pad are specified for LVTTL levels. For other standards, adjust the delays by the
values shown. A delay adjusted in this way constitutes a worst-case limit.
Symbol
Description
Speed Grade
Units
-6
-5
Max
GCLK Clock Skew
TGSKEWIOB
Global clock skew between IOB flip-flops
0.13
0.14
ns
Notes:
1.
These clock distribution delays are provided for guidance only. They reflect the delays encountered in a typical design under
worst-case conditions. Precise values for a particular design are provided by the timing analyzer.
Symbol
Description
Speed Grade
Units
-6
-5
Max
GCLK IOB and Buffer
TGPIO
Global clock pad to output
0.7
0.8
ns
TGIO
Global clock buffer I input to O output
0.7
0.8
ns
Symbol
Description
Standard
Speed Grade
Units
-6
-5
Data Input Delay Adjustments
TGPLVTTL
Standard-specific global clock
input delay adjustments
LVTTL
0
ns
TGPLVCMOS2
LVCMOS2
–0.04
–0.05
ns
TGPPCI33_3
PCI, 33 MHz, 3.3V
–0.11
–0.13
ns
TGPPCI33_5
PCI, 33 MHz, 5.0V
0.26
0.30
ns
TGPPCI66_3
PCI, 66 MHz, 3.3V
–0.11
–0.13
ns
TGPGTL
GTL
0.80
0.84
ns
TGPGTLP
GTL+
0.71
0.73
ns
TGPHSTL
HSTL
0.63
0.64
ns
TGPSSTL2
SSTL2
0.52
0.51
ns
TGPSSTL3
SSTL3
0.56
0.55
ns
TGPCTT
CTT
0.62
ns
TGPAGP
AGP
0.54
0.53
ns
Notes:
1.
Input timing for GPLVTTL is measured at 1.4V. For other I/O standards, see the table "Delay Measurement Methodology," page 60.
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