參數(shù)資料
型號(hào): XC25BS5001MR-G
廠商: Torex Semiconductor Ltd
文件頁(yè)數(shù): 3/12頁(yè)
文件大?。?/td> 0K
描述: IC CLK BUFFER PLL SOT26
標(biāo)準(zhǔn)包裝: 3,000
類型: *
PLL:
輸入: 時(shí)鐘
輸出: 三態(tài)
電路數(shù): 1
比率 - 輸入:輸出: 1:1
差分 - 輸入:輸出: 無/無
頻率 - 最大: 30MHz
除法器/乘法器: 是/是
電源電壓: 2.97 V ~ 5.5 V
工作溫度: -30°C ~ 80°C
安裝類型: 表面貼裝
封裝/外殼: SOT-23-6
供應(yīng)商設(shè)備封裝: SOT-26
包裝: 帶卷 (TR)
11/12
XC25BS5
Series
USP-6B Power Dissipation
Board Mount (Tj max = 125
)
Ambient Temperature(℃)
Power Dissipation Pd(mW)
Thermal Resistance (℃/W)
25
1000
85
400
100.00
PACKAGING INFORMATION (Continued)
Power dissipation data for the USP-6B is shown in this page.
The value of power dissipation varies with the mount board conditions.
Please use this data as one of reference data taken in the described condition.
1.
Measurement Condition (Reference data)
Condition: Mount on a board
Ambient: Natural convection
Soldering: Lead (Pb) free
Board: Dimensions 40 x 40 mm (1600 mm
2 in one side)
Copper (Cu) traces occupy 50% of the board area
In top and back faces
Package heat-sink is tied to the copper traces
Material: Glass Epoxy (FR-4)
Thickness: 1.6 mm
Through-hole: 4 x 0.8 Diameter
Evaluation Board (Unit: mm)
2.
Power Dissipation vs. Ambient Temperature
Pd vs Ta
0
200
400
600
800
1000
1200
25
45
65
85
105
125
Ambient Temperature Ta(℃)
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