XC25BS5 Series SOT-26 Power Dissipation Board Mount (Tj max = 125 ) Ambient Temperature(℃) Power " />
參數(shù)資料
型號: XC25BS5001MR-G
廠商: Torex Semiconductor Ltd
文件頁數(shù): 2/12頁
文件大小: 0K
描述: IC CLK BUFFER PLL SOT26
標準包裝: 3,000
類型: *
PLL:
輸入: 時鐘
輸出: 三態(tài)
電路數(shù): 1
比率 - 輸入:輸出: 1:1
差分 - 輸入:輸出: 無/無
頻率 - 最大: 30MHz
除法器/乘法器: 是/是
電源電壓: 2.97 V ~ 5.5 V
工作溫度: -30°C ~ 80°C
安裝類型: 表面貼裝
封裝/外殼: SOT-23-6
供應商設備封裝: SOT-26
包裝: 帶卷 (TR)
10/12
XC25BS5 Series
SOT-26 Power Dissipation
Board Mount (Tj max = 125
)
Ambient Temperature(℃)
Power Dissipation Pd(mW)
Thermal Resistance (℃/W)
25
600
85
240
166.67
Pd-Ta特性グラフ
0
100
200
300
400
500
600
700
25
45
65
85
105
125
周辺溫度Ta(℃)
許容損失
Pd(m
W)
Power dissipation data for the SOT-26 is shown in this page.
The value of power dissipation varies with the mount board conditions.
Please use this data as one of reference data taken in the described condition.
1.
Measurement Condition (Reference data)
Condition: Mount on a board
Ambient: Natural convection
Soldering: Lead (Pb) free
Board: Dimensions 40 x 40 mm (1600 mm
2 in one side)
Copper (Cu) traces occupy 50% of the board area
In top and back faces
Package heat-sink is tied to the copper traces
Material: Glass Epoxy (FR-4)
Thickness: 1.6 mm
Through-hole: 4 x 0.8 Diameter
Evaluation Board (Unit: mm)
2.
Power Dissipation vs. Ambient Temperature
Pd vs. Ta
Ambient Temperature Ta (
)
Power
Diss
ip
a
tion
Pd
(mW)
PACKAGING INFORMATION (Continued)
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