參數(shù)資料
型號: XC17256EPDG8C
廠商: Xilinx Inc
文件頁數(shù): 6/15頁
文件大?。?/td> 0K
描述: IC PROM SERIAL 256K 8-DIP
產(chǎn)品變化通告: XC1700 PROMs,XC5200,HQ,SCD Parts Discontinuation 19/Jul/2010
Product Discontinuation 28/Jul/2010
標準包裝: 50
可編程類型: OTP
存儲容量: 256Kb
電源電壓: 4.75 V ~ 5.25 V
工作溫度: 0°C ~ 70°C
封裝/外殼: 8-DIP(0.300",7.62mm)
供應商設備封裝: 8-PDIP
包裝: 管件
其它名稱: 122-1576-5
14
Device Package User Guide
UG112 (v3.7) September 5, 2012
Chapter 1: Package Information
R
Examples
CPLD Ordering Information
An example of an ordering number for a Xilinx CPLD is XC2C256-7PQ108I, and is defined
as follows:
XC2C – Family (CoolRunner-II)
256 – Number of macrocells (256 macrocells)
-7 – Speed grade (-7 speed)
PQ – Package type (Plastic Quad Flat Pack)
208 – Number of pins (208 pins)
I – Temperature grade (Industrial)
PROM Ordering Information
An example of an ordering number for a Xilinx PROM is XC18V04VQ44C, and is defined
as follows:
XC18V – Family - 1800 (ISP) PROM
04 – PROM size (18V00, 17V00, 1700E/L) or equivalent Spartan-II or Spartan-IIE
device (17S00A/XL/L), 4 Mb of storage capacity
VQ – Package type (Plastic Quad Flat Pack)
44 – Number of pins (44 pins)
C – Temperature grade (commercial)
To determine the valid ordering combinations for a given device, consult the device data
sheet. Data sheets are available at
Marking Template
Large Form Factor Packages
On December 26, 1995, Product Change Notice (PCN) 95013 was issued to acknowledge a
change to the Xilinx standard for package marking. You can view this notice at
Xilinx part marking follows generalized marking templates that are different for small and
large packages. Within each group, some minor variations exist due to device family
branding.
The large package template (Figure 1-1) consists of the Xilinx Logo, the family brand logo,
and 4 lines of information.
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