參數(shù)資料
型號： XA3SD1800A-4FGG676Q
廠商： Xilinx Inc
文件頁數(shù)： 55/58頁
文件大?。?/td> 0K
描述： SPARTAN-3ADSP FPGA 1800K 676FBGA
產(chǎn)品培訓模塊： Extended Spartan 3A FPGA Family
標準包裝： 40
系列： Spartan®-3A DSP XA
LAB/CLB數(shù)： 4160
邏輯元件/單元數(shù)： 37440
RAM 位總計： 1548288
輸入/輸出數(shù)： 519
門數(shù)： 1800000
電源電壓： 1.14 V ~ 1.26 V
安裝類型： 表面貼裝
工作溫度： -40°C ~ 125°C
封裝/外殼： 676-BGA
供應(yīng)商設(shè)備封裝： 676-FBGA（27x27）
配用： 122-1574-ND - KIT DEVELOPMENT SPARTAN 3ADSP
XA Spartan-3A DSP Automotive FPGA Family Data Sheet
DS705 (v2.0) April 18, 2011
Product Specification
6
DC Electrical Characteristics
All parameter limits are representative of worst-case supply voltage and junction temperature conditions. Unless otherwise
noted, the published parameter values apply to all XA Spartan-3A DSP devices. AC and DC characteristics are specified
using the same numbers for both I-Grade and Q-Grade.
Absolute Maximum Ratings
Stresses beyond those listed under Table 4, Absolute Maximum Ratings might cause permanent damage to the device.
These are stress ratings only; functional operation of the device at these or any other conditions beyond those listed under
the Recommended Operating Conditions is not implied. Exposure to absolute maximum conditions for extended periods of
time adversely affects device reliability.
Table 4: Absolute Maximum Ratings
Symbol
Description
Conditions
Min
Max
Units
VCCINT
Internal supply voltage
–0.5
1.32
V
VCCAUX
Auxiliary supply voltage
–0.5
3.75
V
VCCO
Output driver supply voltage
–0.5
3.75
V
VREF
Input reference voltage
–0.5
VCCO +0.5
V
VIN
Voltage applied to all User I/O pins and
Dual-Purpose pins
Driver in a high-impedance state
–0.95
4.6
V
Voltage applied to all Dedicated pins
–0.5
4.6
V
IIK
Input clamp current per I/O pin
–0.5V < VIN <(VCCO +0.5V) (1)
–
±100
mA
VESD
Electrostatic Discharge Voltage
Human body model
–
±2000
V
Charged device model
–
±500
V
Machine model
–
±200
V
TJ
Junction temperature
–
125
°C
TSTG
Storage temperature
–65
150
°C
Notes:
1.
Upper clamp applies only when using PCI IOSTANDARDs.
2.
For soldering guidelines, see UG112: Device Packaging and Thermal Characteristics and XAPP427: Implementation and Solder Reflow
Guidelines for Pb-Free Packages.
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