參數(shù)資料
型號(hào)： XA3S250E-4FTG256I
廠商： Xilinx Inc
文件頁數(shù)： 30/37頁
文件大?。?/td> 0K
描述： IC FPGA SPARTAN-3E 250K 456-FBGA
標(biāo)準(zhǔn)包裝： 90
系列： Spartan®-3E XA
LAB/CLB數(shù)： 612
邏輯元件/單元數(shù)： 5508
RAM 位總計(jì)： 221184
輸入/輸出數(shù)： 172
門數(shù)： 250000
電源電壓： 1.14 V ~ 1.26 V
安裝類型： 表面貼裝
工作溫度： -40°C ~ 100°C
封裝/外殼： 256-LBGA
供應(yīng)商設(shè)備封裝： 256-FTBGA
DS635 (v2.0) September 9, 2009
Product Specification
36
R
Revision History
The following table shows the revision history for this document.
Notice of Disclaimer
THE XILINX HARDWARE FPGA AND CPLD DEVICES REFERRED TO HEREIN (“PRODUCTS”) ARE SUBJECT TO THE TERMS AND
CONDITIONS OF THE XILINX LIMITED WARRANTY WHICH CAN BE VIEWED AT http://www.xilinx.com/warranty.htm. THIS LIMITED
WARRANTY DOES NOT EXTEND TO ANY USE OF PRODUCTS IN AN APPLICATION OR ENVIRONMENT THAT IS NOT WITHIN THE
SPECIFICATIONS STATED IN THE XILINX DATA SHEET. ALL SPECIFICATIONS ARE SUBJECT TO CHANGE WITHOUT NOTICE.
PRODUCTS ARE NOT DESIGNED OR INTENDED TO BE FAIL-SAFE OR FOR USE IN ANY APPLICATION REQUIRING FAIL-SAFE
PERFORMANCE, SUCH AS LIFE-SUPPORT OR SAFETY DEVICES OR SYSTEMS, OR ANY OTHER APPLICATION THAT INVOKES
THE POTENTIAL RISKS OF DEATH, PERSONAL INJURY, OR PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL
APPLICATIONS”). USE OF PRODUCTS IN CRITICAL APPLICATIONS IS AT THE SOLE RISK OF CUSTOMER, SUBJECT TO
APPLICABLE LAWS AND REGULATIONS.
Date
Version
Revision
08/31/07
1.0
Initial Xilinx release.
01/20/09
1.1
Updated TACC requirement in Table 43.
Updated description of TDCC and TCCD in Table 42.
Removed Table 45: MultiBoot Trigger Timing.
09/09/09
2.0
Added package sizes to Table 2, page 4.
Removed Genealogy Viewer Link from "Package Marking," page 5.
Updated data and notes for Table 6, page 8.
Updated test conditions for RPU and maximum value for CIN in Table 7, page 8.
Updated notes for Table 8, page 9.
Updated Max VCCO for LVTTL and LVCMOS33, removed PCIX data, updated VIL Max for
LVCMOS18, LVCMOS15, and LVCMOS12, updated VIH Min for LVCMOS12, and added
Removed PCIX data, revised note 2, and added note 4 in Table 10, page 12.
Updated figure description of Figure 5, page 14.
Added note 4 to Table 13, page 14.
Removed PC166_3 and PCIX adjustment values from Table 17, page 17.
Deleted Table 18 (duplicate of Table 17, page 17). Subsequent tables renumbered.
Removed PCIX data Table 18, page 18.
Removed PCIX data and removed VREF values for DIFF_HSTL_I_18,
DIFF_HSTL_III_18, DIFF_SSTL18_I, and DIFF_SSTL2_I from Table 19, page 19.
Updated TDICK minimum setup time in Table 20, page 20.
Updated notes, references to notes, and revised the maximum clock-to-output times for
Updated note 3 in Table 26, page 25.
Added note 4 Table 28, page 26.
Updated notes, references to notes, and CLKOUT_PER_JITT_FX data in Table 29,
Updated MAX_STEPS data in Table 31, page 28.
Updated ConfigRate Setting for TCCLK1 to indicate 1 is the default value in Table 34,
Updated ConfigRate Setting for FCCLK1 to indicate 1 is the default value in Table 35,
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
XA3S250E-4FTG256Q 功能描述:IC FPGA SPARTAN-3E 250K 456-FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:Spartan®-3E XA 標(biāo)準(zhǔn)包裝:40 系列:Spartan® 6 LX LAB/CLB數(shù):3411 邏輯元件/單元數(shù):43661 RAM 位總計(jì):2138112 輸入/輸出數(shù):358 門數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:676-BGA 供應(yīng)商設(shè)備封裝:676-FBGA（27x27）
XA3S250E-4PQG208I 功能描述:IC FPGA SPARTAN-3E 250K 208-PQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:Spartan®-3E XA 標(biāo)準(zhǔn)包裝:40 系列:Spartan® 6 LX LAB/CLB數(shù):3411 邏輯元件/單元數(shù):43661 RAM 位總計(jì):2138112 輸入/輸出數(shù):358 門數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:676-BGA 供應(yīng)商設(shè)備封裝:676-FBGA（27x27）
XA3S250E-4PQG208Q 功能描述:IC FPGA SPARTAN-3E 250K 208-PQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:Spartan®-3E XA 標(biāo)準(zhǔn)包裝:40 系列:Spartan® 6 LX LAB/CLB數(shù):3411 邏輯元件/單元數(shù):43661 RAM 位總計(jì):2138112 輸入/輸出數(shù):358 門數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:676-BGA 供應(yīng)商設(shè)備封裝:676-FBGA（27x27）
XA3S250E-4TQG144I 功能描述:IC FPGA SPARTAN-3E 250K 144-TQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:Spartan®-3E XA 標(biāo)準(zhǔn)包裝:40 系列:Spartan® 6 LX LAB/CLB數(shù):3411 邏輯元件/單元數(shù):43661 RAM 位總計(jì):2138112 輸入/輸出數(shù):358 門數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:676-BGA 供應(yīng)商設(shè)備封裝:676-FBGA（27x27）
XA3S250E-4TQG144Q 功能描述:IC FPGA SPARTAN-3E 250K 144-TQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:Spartan®-3E XA 標(biāo)準(zhǔn)包裝:40 系列:Spartan® 6 LX LAB/CLB數(shù):3411 邏輯元件/單元數(shù):43661 RAM 位總計(jì):2138112 輸入/輸出數(shù):358 門數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:676-BGA 供應(yīng)商設(shè)備封裝:676-FBGA（27x27）
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