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參數(shù)資料
| 型號(hào)： | X28C64TMB-25 |
| 英文描述： | 5 Volt, Byte Alterable E2PROM |
| 中文描述： | 5伏，可變E2PROM的字節(jié) |
| 文件頁數(shù)： | 20/25頁 |
| 文件大小： | 110K |
| 代理商： | X28C64TMB-25 |
20
X28C64
0.2980 (7.5692)
0.2920 (7.4168)
0.4160 (10.5664)
0.3980 (10.1092)
0.0192 (0.4877)
0.0138 (0.3505)
0.0160 (0.4064)
0.0100 (0.2540)
0.050 (1.270)
BSC
0.7080 (17.9832)
0.7020 (17.8308)
0.0110 (0.2794)
0.0040 (0.1016)
0.1040 (2.6416)
0.0940 (2.3876)
0.0350 (0.8890)
0.0160 (0.4064)
0.0125 (0.3175)
0.0090 (0.2311)
0
°
– 8
°
X 45
°
3926 FHD F17
28-LEAD PLASTIC SMALL OUTLINE GULL WING PACKAGE TYPE S
NOTES:
1. ALL DIMENSIONS IN INCHES (IN PARENTHESES IN MILLIMETERS)
2. FORMED LEAD SHALL BE PLANAR WITH RESPECT TO ONE ANOTHER WITHIN 0.004 INCHES
3. BACK EJECTOR PIN MARKED “KOREA”
4. CONTROLLING DIMENSION: INCHES (MM)
SEATING PLANE
BASE PLANE
PACKAGING INFORMATION
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| X28C64DM-25 | 5 Volt, Byte Alterable E2PROM |
| X28C64FM-15 | 5 Volt, Byte Alterable E2PROM |
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| X28F00AH33EF95C | 制造商:Micron Technology Inc 功能描述:X28F00AH33EF95C - Trays |
| X28F024M180F96C | 制造商:Micron Technology Inc 功能描述:WIRELESS 制造商:Micron Technology Inc 功能描述:WIRELESS - Gel-pak, waffle pack, wafer, diced wafer on film |
| X28F024M181F96C | 制造商:Micron Technology Inc 功能描述:WIRELESS 制造商:Micron Technology Inc 功能描述:WIRELESS - Gel-pak, waffle pack, wafer, diced wafer on film |
| X28F128M180F96C | 制造商:Micron Technology Inc 功能描述:WIRELESS 制造商:Micron Technology Inc 功能描述:WIRELESS - Gel-pak, waffle pack, wafer, diced wafer on film |
| X28F128M181F96C | 制造商:Micron Technology Inc 功能描述:WIRELESS 制造商:Micron Technology Inc 功能描述:WIRELESS - Gel-pak, waffle pack, wafer, diced wafer on film |
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