參數(shù)資料
型號: WS512K32V-XXX
英文描述: 512Kx32 SRAM 3.3V MULTICHIP PACKAGE
中文描述: 512Kx32 SRAM的3.3多芯片封裝
文件頁數(shù): 6/7頁
文件大?。?/td> 302K
代理商: WS512K32V-XXX
6
White Electronic Designs Corporation (602) 437-1520 www.wedc.com
White Electronic Designs
WS512K32V-XXX
March 2006
Rev. 12
27.3 (1.075) ± 0.25 (0.010) SQ
PINSQUARE PAD
ON BOTTOM
25.4 (1.0) TYP
0.46 (0.018) ± 0.05 (0.002) DIA
1.42 (0.056) ± 0.13 (0.005)
0.76 (0.030) ± 0.13 (0.005)
1.27 (0.050) TYP DIA
25.4 (1.0) TYP
15.24 (0.600) TYP
2.54 (0.TYP
± 3.81 (0.150)
4.60 (0MAX
PACKAGE 510: 68 LEAD, LOW PROFILE CERAMIC QUAD FLAT PACK, CQFP (G2U)
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
0.38 (0.015) ± 0.05 (0.002)
20.3 (0.800) REF
0.25 (0.010) ± 0.10 (0.002)
25.15 (0.990) ± 0.25 (0.010) SQ
1.27 (0.050) TYP
24.0 (0.946)
22.36 (0.880) ± 0.25 (0.010) SQ
(0.23.87
1.01 (0.040)
0.25 (0.010) REF
1° / 7°
(R 0.25
DETAIL A
SEE DETAIL "A"
Pin 1
0.53 (0.021)
3.51 (0.140) MAX
PACKAGE 400: 66 PIN, PGA TYPE, CERAMIC HEX-IN-LINE PACKAGE, HIP (H1)
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
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