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參數(shù)資料
| 型號： | WS512K32V-85 |
| 英文描述： | 512Kx32 3.3V SRAM Module(512Kx32, 3.3V,靜態(tài)RAM模塊（存取時間85ns）) |
| 中文描述： | 512Kx32 3.3靜態(tài)存儲器模塊（512Kx32，3.3伏，靜態(tài)內(nèi)存模塊（存取時間85ns）） |
| 文件頁數(shù)： | 1/8頁 |
| 文件大?。?/td> | 212K |
| 代理商： | WS512K32V-85 |
1
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
HI-RELIABILITY PRODUCT
WS512K32V-XXX
512Kx32 SRAM 3.3V MODULE
ADVANCED*
FEATURES
I
Access Times of 70, 85, 100, 120ns
I
Packaging
66-pin, PGA Type, 1.185 inch square, Hermetic
Ceramic HIP (Package 401)
68 lead, Hermetic CQFP (G2T), 22.4mm (0.880 inch) square
4.57mm (0.180 inch) high (Package 509). Designed to fit
JEDEC 68 lead 0.990" CQFJ footprint.
I
Organized as 512Kx32, User Configurable as 1024Kx16 or
2Mx8
I
Commercial, Industrial and Military Temperature Ranges
I
TTL Compatible Inputs and Outputs
I
Low Voltage
3.3V
±
10% Power Supply
I
Low Power CMOS
I
Built-in Decoupling Caps and Multiple Ground Pins for Low
Noise Operation
I
Weight
WS512K32V-XG2TX - 8 grams typical
WS512K32V-XHX - 13 grams typical
*
This data sheet describes a product that may or may not be under development
and is subject to change or cancellation without notice.
February 2000 Rev. 2
FIG. 1
PIN CONFIGURATION FOR WS512K32V-XHX
BLOCK DIAGRAM
TOP VIEW
512K x 8
8
I/O
0-7
WE
CS
1
1
512K x 8
8
I/O
8-15
WE
CS
2
2
512K x 8
8
I/O
16-23
WE
CS
3
3
512K x 8
8
I/O
24-31
WE
CS
4
4
A
0
-
18
OE
PIN DESCRIPTION
I/O
8
I/O
9
I/O
10
A
13
A
14
A
15
A
16
A
17
I/O
0
I/O
1
I/O
2
WE
2
CS
2
GND
I/O
11
A
10
A
11
A
12
V
CC
CS
1
NC
I/O
3
I/O
15
I/O
14
I/O
13
I/O
12
OE
A
18
WE
1
I/O
7
I/O
6
I/O
5
I/O
4
I/O
24
I/O
25
I/O
26
A
6
A
7
NC
A
8
A
9
I/O
16
I/O
17
I/O
18
V
CC
CS
4
WE
4
I/O
27
A
3
A
4
A
5
WE
3
CS
3
GND
I/O
19
I/O
31
I/O
30
I/O
29
I/O
28
A
0
A
1
A
2
I/O
23
I/O
22
I/O
21
I/O
20
11 22 33 44 55 66
1 12 23 34 45 56
I/O
0
-
31
A
0-18
WE
1-4
CS
1-4
OE
V
CC
GND
NC
Data Inputs/Outputs
Address Inputs
Write Enables
Chip Selects
Output Enable
Power Supply
Ground
Not Connected
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| WS512K32V-120 | 512Kx32 3.3V SRAM Module(512Kx32, 3.3V,靜態(tài)RAM模塊（存取時間120ns）) |
| WS512K32V-15 | 512Kx32 3.3V SRAM Module(512Kx32, 3.3V,靜態(tài)RAM模塊（存取時間15ns）) |
| WS512K32V-17 | 512Kx32 3.3V SRAM Module(512Kx32, 3.3V,靜態(tài)RAM模塊（存取時間17ns）) |
| WS512K32V-20 | 512Kx32 3.3V SRAM Module(512Kx32, 3.3V,靜態(tài)RAM模塊（存取時間20ns）) |
| WS512K32V-XXX | 512Kx32 SRAM 3.3V MULTICHIP PACKAGE |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| WS512K32V-XG1TX | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:SRAM MCP |
| WS512K32V-XG1UX | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:SRAM MCP |
| WS512K32V-XG2TX | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:SRAM MCP |
| WS512K32V-XG2UX | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:SRAM MCP |
| WS512K32V-XXX | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:512Kx32 SRAM 3.3V MULTICHIP PACKAGE |
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