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參數(shù)資料
| 型號(hào)： | WS512K32NV-20H1I |
| 元件分類： | SRAM |
| 英文描述： | 512K X 32 MULTI DEVICE SRAM MODULE, 20 ns, CHIP66 |
| 封裝： | CERAMIC, HIP-66 |
| 文件頁數(shù)： | 8/8頁 |
| 文件大小： | 105K |
| 代理商： | WS512K32NV-20H1I |
8
White Electronic Designs Corporation Phoenix, AZ (602) 437-1520
WS512K32V-XXX
ORDERING INFORMATION
LEAD FINISH:
Blank = Gold plated leads
A = Solder dip leads
DEVICE GRADE:
M = Military Screened
-55
°C to +125°C
I = Industrial
-40
°C to +85°C
C = Commercial
0
°C to +70°C
PACKAGE TYPE:
H1 = 1.075" sq. Ceramic Hex In Line Package, HIP (Package 400)
G2T = 22mm Ceramic Quad Flat Pack, Low Profile CQFP (Package 509)
ACCESS TIME (ns)
Low Voltage Supply 3.3V
± 10%
IMPROVEMENT MARK:
N = No Connect at pin 21 and 39 in HIP for Upgrades
ORGANIZATION, 512Kx32
User configurable as 1Mx16 or 2Mx8
SRAM
WHITE ELECTRONIC DESIGNS CORP.
W S
512K 32 X V - XXX X X X
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| WS512K32NV-17H1C | 512K X 32 MULTI DEVICE SRAM MODULE, 17 ns, CHIP66 |
| WS512K32V-17G2TMA | 512K X 32 MULTI DEVICE SRAM MODULE, 17 ns, CQFP68 |
| WS512K32NV-70HIA | 512K X 32 MULTI DEVICE SRAM MODULE, 70 ns, CHIP66 |
| WS512K32NV-100HIA | 512K X 32 MULTI DEVICE SRAM MODULE, 100 ns, CHIP66 |
| WS512K32NV-70HCA | 512K X 32 MULTI DEVICE SRAM MODULE, 70 ns, CHIP66 |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| WS512K32NV-20H1IA | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:512Kx32 SRAM 3.3V MODULE |
| WS512K32NV-20H1M | 制造商:Microsemi Corporation 功能描述:512K X 32 SRAM MODULE, 3.3V, 20NS, NO CONNECT, 66 PGA 1.075" - Bulk |
| WS512K32NV-20H1MA | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:512Kx32 SRAM 3.3V MODULE |
| WS512K32NV-XH1X | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:SRAM MCP |
| WS512K32NV-XHX | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:SRAM MCP |
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