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參數(shù)資料
| 型號： | WS512K32NV-20H1I |
| 元件分類： | SRAM |
| 英文描述： | 512K X 32 MULTI DEVICE SRAM MODULE, 20 ns, CHIP66 |
| 封裝： | CERAMIC, HIP-66 |
| 文件頁數(shù)： | 1/8頁 |
| 文件大小： | 105K |
| 代理商： | WS512K32NV-20H1I |
1
White Electronic Designs Corporation Phoenix, AZ (602) 437-1520
HI-RELIABILITY PRODUCT
WS512K32V-XXX
512Kx32 SRAM 3.3V MODULE
ADVANCED*
s Low Power CMOS
s TTL Compatible Inputs and Outputs
s Fully Static Operation:
No clock or refresh required.
s Three State Output.
s Built-in Decoupling Caps and Multiple Ground Pins for Low
Noise Operation
s Weight
WS512K32V-XG2TX - 8 grams typical
WS512K32NV-XH1X - 13 grams typical
* This data sheet describes a product that may or may not be under
development and is subject to change or cancellation without notice.
FEATURES
s Access Times of 15, 17, 20ns
s MIL-STD-883 Compliant Devices Available
s Low Voltage Operation
s Packaging
66-pin, PGA Type, 1.075 inch square, Hermetic
Ceramic HIP (Package 400)
68 lead, 22mm Low Profile CQFP, 4.6mm (0.180"),
(Package 509)
s Organized as 512Kx32; User Configurable as 1Mx16 or 2Mx8
s Commercial, Industrial and Military Temperature Ranges
s Low Voltage Operation:
3.3V
± 10% Power Supply
PIN CONFIGURATION FOR WS512K32NV-XH1X
PIN DESCRIPTION
I/O0-31
Data Inputs/Outputs
A0-18
Address Inputs
WE1-4
Write Enables
CS1-4
Chip Selects
OE
Output Enable
VCC
Power Supply
GND
Ground
NC
Not Connected
I/O8
I/O9
I/O10
A13
A14
A15
A16
A17
I/O0
I/O1
I/O2
WE2
CS2
GND
I/O11
A10
A11
A12
VCC
CS1
NC
I/O3
I/O15
I/O14
I/O13
I/O12
OE
A18
WE1
I/O7
I/O6
I/O5
I/O4
I/O24
I/O25
I/O26
A6
A7
NC
A8
A9
I/O16
I/O17
I/O18
VCC
CS4
WE4
I/O27
A3
A4
A5
WE3
CS3
GND
I/O19
I/O31
I/O30
I/O29
I/O28
A0
A1
A2
I/O23
I/O22
I/O21
I/O20
11
22
33
44
55
66
1
12
23
34
45
56
TOP VIEW
BLOCK DIAGRAM
512K x 8
8
I/O 0-7
CS1
512K x 8
8
I/O 8-15
2
512K x 8
8
I/O 16-23
3
512K x 8
8
I/O 24-31
4
A 0-18
OE
WE
CS
WE
CS
WE
CS
WE
12
3
4
July 1999 Rev. 2
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| WS512K32NV-17H1C | 512K X 32 MULTI DEVICE SRAM MODULE, 17 ns, CHIP66 |
| WS512K32V-17G2TMA | 512K X 32 MULTI DEVICE SRAM MODULE, 17 ns, CQFP68 |
| WS512K32NV-70HIA | 512K X 32 MULTI DEVICE SRAM MODULE, 70 ns, CHIP66 |
| WS512K32NV-100HIA | 512K X 32 MULTI DEVICE SRAM MODULE, 100 ns, CHIP66 |
| WS512K32NV-70HCA | 512K X 32 MULTI DEVICE SRAM MODULE, 70 ns, CHIP66 |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| WS512K32NV-20H1IA | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:512Kx32 SRAM 3.3V MODULE |
| WS512K32NV-20H1M | 制造商:Microsemi Corporation 功能描述:512K X 32 SRAM MODULE, 3.3V, 20NS, NO CONNECT, 66 PGA 1.075" - Bulk |
| WS512K32NV-20H1MA | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:512Kx32 SRAM 3.3V MODULE |
| WS512K32NV-XH1X | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:SRAM MCP |
| WS512K32NV-XHX | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:SRAM MCP |
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