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參數資料
| 型號： | WS512K32NV-20H1I |
| 廠商： | WHITE ELECTRONIC DESIGNS CORP |
| 元件分類： | SRAM |
| 英文描述： | 512K X 32 MULTI DEVICE SRAM MODULE, 20 ns, CPGA66 |
| 封裝： | 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66 |
| 文件頁數： | 7/7頁 |
| 文件大?。?/td> | 345K |
| 代理商： | WS512K32NV-20H1I |
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White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
WS512K32V-XXX
March 2006
Rev. 12
ORDERING INFORMATION
WHITE ELECTRONIC DESIGNS CORP.
SRAM
ORGANIZATION, 512Kx32
User congurable as 2x512Kx16 or 4x512Kx8
IMPROVEMENT MARK:
N = No Connect at pin 21 and 39 in HIP for Upgrades (H1 only)
Low Voltage Supply 3.3V ± 10%
ACCESS TIME (ns)
PACKAGE TYPE:
H1 = 1.075" sq. Ceramic Hex In Line Package, HIP (Package 400)
G2U = 22.4mm Ceramic Quad Flat Pack, CQFP (Package 510)
DEVICE GRADE:
M = Military
-55°C to +125°C
I = Industrial
-40°C to +85°C
C = Commercial
0°C to +70°C
LEAD FINISH:
Blank = Gold plated leads
A = Solder dip leads
W S 512K 32 X V - XXX X X X
相關PDF資料 |
PDF描述 |
|---|---|
| WS512K32NV-20H1I | 512K X 32 MULTI DEVICE SRAM MODULE, 20 ns, CHIP66 |
| WS512K32NV-17H1C | 512K X 32 MULTI DEVICE SRAM MODULE, 17 ns, CHIP66 |
| WS512K32V-17G2TMA | 512K X 32 MULTI DEVICE SRAM MODULE, 17 ns, CQFP68 |
| WS512K32NV-70HIA | 512K X 32 MULTI DEVICE SRAM MODULE, 70 ns, CHIP66 |
| WS512K32NV-100HIA | 512K X 32 MULTI DEVICE SRAM MODULE, 100 ns, CHIP66 |
相關代理商/技術參數 |
參數描述 |
|---|---|
| WS512K32NV-20H1IA | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:512Kx32 SRAM 3.3V MODULE |
| WS512K32NV-20H1M | 制造商:Microsemi Corporation 功能描述:512K X 32 SRAM MODULE, 3.3V, 20NS, NO CONNECT, 66 PGA 1.075" - Bulk |
| WS512K32NV-20H1MA | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:512Kx32 SRAM 3.3V MODULE |
| WS512K32NV-XH1X | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:SRAM MCP |
| WS512K32NV-XHX | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:SRAM MCP |
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