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參數(shù)資料
| 型號： | WS512K32L-25G1TC |
| 廠商： | WHITE ELECTRONIC DESIGNS CORP |
| 元件分類： | SRAM |
| 英文描述： | 512K X 32 MULTI DEVICE SRAM MODULE, 25 ns, CQFP68 |
| 封裝： | 23.90 X 23.90 MM, 4.06 MM HEIGHT, HERMETIC SEALED, CERAMIC, QFP-68 |
| 文件頁數(shù)： | 2/13頁 |
| 文件大?。?/td> | 485K |
| 代理商： | WS512K32L-25G1TC |
10
White Electronic Designs Corporation Phoenix AZ (602) 437-1520
WS512K32-XXX
White Electronic Designs
LEAD FINISH:
Blank = Gold plated leads
A = Solder dip leads
DEVICE GRADE:
Q = MIL-STD-883 Compliant
M = Military Screened-55°C to +125°C
I = Industrial
-40°C to 85°C
C = Commercial
0°C to +70°C
PACKAGE TYPE:
H1= Ceramic Hex-In-line Package, HIP (Package 400)
G2U = 22.4mm Ceramic Quad Flat Pack, CQFP (Package 510)
G2L = 22.4mm Ceramic Quad Flat Pack, CQFP (Package 528)
G4T1 = 40mm Low Profile CQFP (Package 502)
G1U1 = 23.9mm Low Profile CQFP (Package 519)
G1T = 23.9mm Low Profile CQFP (Package 524)
ACCESS TIME (ns)
IMPROVEMENT MARK:
Blank = Standard Power
N = No Connect at pin 21 and 39 in HIP for Upgrades
L = Low Power Data Retention
ORGANIZATION, 512Kx32
User configurable as 1Mx16 or 2Mx8
SRAM
WHITE ELECTRONIC DESIGNS CORP.
W S 512K 32 X - XXX X X X
Note 1: Package Not Recommended For New Design
ORDERING INFORMATION
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相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| WS512K32N-100HC | 制造商:Microsemi Corporation 功能描述:512K X 32 SRAM MODULE, 5V, 100NS, NO CONNECT, 66 PGA 1.185" - Bulk |
| WS512K32N-100HI | 制造商:Microsemi Corporation 功能描述:512K X 32 SRAM MODULE, 5V, 100NS, NO CONNECT, 66 PGA 1.185" - Bulk |
| WS512K32N-17H1C | 制造商:Microsemi Corporation 功能描述:512K X 32 SRAM MODULE, 5V, 17NS, NO CONNECT, 66 PGA 1.075" S - Bulk |
| WS512K32N-17H1CA | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:SRAM|512KX32|CMOS|PGA|66PIN|CERAMIC |
| WS512K32N-17H1I | 制造商:Microsemi Corporation 功能描述:512K X 32 SRAM MODULE, 5V, 17NS, NO CONNECT, 66 PGA 1.075" S - Bulk |
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