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參數(shù)資料
| 型號(hào)： | WS128K32V-17G2UMA |
| 廠商： | MICROSEMI CORP-PMG MICROELECTRONICS |
| 元件分類(lèi)： | SRAM |
| 英文描述： | 128K X 32 MULTI DEVICE SRAM MODULE, 17 ns, CQFP68 |
| 封裝： | 22.40 X 22.40 MM, CERAMIC, QFP-68 |
| 文件頁(yè)數(shù)： | 8/8頁(yè) |
| 文件大?。?/td> | 462K |
| 代理商： | WS128K32V-17G2UMA |
8
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
WS128K32V-XXX
March 2006
Rev. 8
W S 128K 32 X V - XXX X X X
LEAD FINISH:
Blank = Gold plated leads
A = Solder dip leads
DEVICE GRADE:
M = Military Screened
-55°C to +125°C
I = Industrial -40°C to +85°C
C = Commercial 0°C to +70°C
PACKAGE TYPE:
H1 = Ceramic Hex-In-line Package, HIP (Package 400)
G2U = 22.4mm Ceramic Quad Flat Pack, Low Prole CQFP (Package 510)
ACCESS TIME (ns)
LOW VOLTAGE SUPPLY 3.3V ± 10%
IMPROVEMENT MARK:
N = No Connect at pins 8, 21, 28, 39 in HIP for upgrade. (H1 only)
ORGANIZATION, 128Kx32
User congurable as 256Kx16 or 512Kx8
SRAM
WHITE ELECTRONIC DESIGNS CORP.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| WS128K32V-17H1C | 制造商:未知廠家 制造商全稱(chēng):未知廠家 功能描述:128Kx32 3.3V SRAM MULTICHIP PACKAGE |
| WS128K32V-17H1CA | 制造商:未知廠家 制造商全稱(chēng):未知廠家 功能描述:128Kx32 3.3V SRAM MULTICHIP PACKAGE |
| WS128K32V-17H1I | 制造商:未知廠家 制造商全稱(chēng):未知廠家 功能描述:128Kx32 3.3V SRAM MULTICHIP PACKAGE |
| WS128K32V-17H1IA | 制造商:未知廠家 制造商全稱(chēng):未知廠家 功能描述:128Kx32 3.3V SRAM MULTICHIP PACKAGE |
| WS128K32V-17H1M | 制造商:未知廠家 制造商全稱(chēng):未知廠家 功能描述:128Kx32 3.3V SRAM MULTICHIP PACKAGE |
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