參數(shù)資料
型號(hào): WS128K32NV-17H1CA
廠商: MICROSEMI CORP-PMG MICROELECTRONICS
元件分類: SRAM
英文描述: 128K X 32 MULTI DEVICE SRAM MODULE, 17 ns, CPGA66
封裝: 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66
文件頁(yè)數(shù): 6/8頁(yè)
文件大?。?/td> 462K
代理商: WS128K32NV-17H1CA
6
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
WS128K32V-XXX
March 2006
Rev. 8
PACKAGE 400: 66 PIN, PGA TYPE, CERAMIC HEX-IN-LINE PACKAGE, HIP (H1)
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
4.60 (0.181)
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
WS128K32NV-17H1I 制造商:Microsemi Corporation 功能描述:128K X 32 SRAM MODULE, 3.3V, 17NS, NO CONNECT, 66 PGA 1.075" - Bulk
WS128K32NV-17H1IA 制造商:未知廠家 制造商全稱:未知廠家 功能描述:128Kx32 3.3V SRAM MULTICHIP PACKAGE
WS128K32NV-17H1M 制造商:Microsemi Corporation 功能描述:128K X 32 SRAM MODULE, 3.3V, 17NS, NO CONNECT, 66 PGA 1.075" - Bulk
WS128K32NV-17H1MA 制造商:未知廠家 制造商全稱:未知廠家 功能描述:128Kx32 3.3V SRAM MULTICHIP PACKAGE
WS128K32NV-20G1UC 制造商:未知廠家 制造商全稱:未知廠家 功能描述:128Kx32 3.3V SRAM MULTICHIP PACKAGE