參數(shù)資料
型號: WS128K32N-35G2LQ
廠商: WHITE ELECTRONIC DESIGNS CORP
元件分類: SRAM
英文描述: 128K X 32 MULTI DEVICE SRAM MODULE, 35 ns, CQFP68
封裝: 22.36 X 22.36 MM, CERAMIC, QFP-68
文件頁數(shù): 6/9頁
文件大?。?/td> 546K
代理商: WS128K32N-35G2LQ
6
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
WS128K32-XXX
May 2006
Rev. 17
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
PACKAGE 400: 66 PIN, PGA TYPE, CERAMIC HEX-IN-LINE PACKAGE, HIP (H1)
4.60 (0.181)
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
Note 1: Package Not
Recommended
For New Design
PACKAGE 502: 68 LEAD, CERAMIC QUAD FLAT PACK, LOW PROFILE CQFP (G4T)1
相關(guān)PDF資料
PDF描述
WS128K32N-20H1M 128K X 32 MULTI DEVICE SRAM MODULE, 20 ns, CPGA66
WS128K32L-35G2UM 128K X 32 MULTI DEVICE SRAM MODULE, 35 ns, CQFP68
WS128K32N-20G2UCA 128K X 32 MULTI DEVICE SRAM MODULE, 20 ns, CQFP68
WS128K32N-35G2UC 128K X 32 MULTI DEVICE SRAM MODULE, 35 ns, CQFP68
WS128K32L-20G2UMA 128K X 32 MULTI DEVICE SRAM MODULE, 20 ns, CQFP68
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
WS128K32N-35G2TCE 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:128Kx32 SRAM MULTICHIP PACKAGE, RADIATION TOLLERANT
WS128K32N-35G2TCEA 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:128Kx32 SRAM MULTICHIP PACKAGE, RADIATION TOLLERANT
WS128K32N-35G2TIE 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:128Kx32 SRAM MULTICHIP PACKAGE, RADIATION TOLLERANT
WS128K32N-35G2TIEA 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:128Kx32 SRAM MULTICHIP PACKAGE, RADIATION TOLLERANT
WS128K32N-35G2TME 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:128Kx32 SRAM MULTICHIP PACKAGE, RADIATION TOLLERANT