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| 型號： | WS128K32N-35G2LQ |
| 廠商： | WHITE ELECTRONIC DESIGNS CORP |
| 元件分類： | SRAM |
| 英文描述： | 128K X 32 MULTI DEVICE SRAM MODULE, 35 ns, CQFP68 |
| 封裝： | 22.36 X 22.36 MM, CERAMIC, QFP-68 |
| 文件頁數(shù)： | 1/9頁 |
| 文件大?。?/td> | 546K |
| 代理商： | WS128K32N-35G2LQ |
1
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
WS128K32-XXX
May 2006
Rev. 17
128Kx32 SRAM MODULE, SMD 5962-93187 & 5962-95595
Low Power CMOS
TTL Compatible Inputs and Outputs
Built in Decoupling Caps and Multiple Ground Pins
for Low Noise Operation
Weight:
WS128K32-XG2UX - 8 grams typical
WS128K32-XG2LX - 8 grams typical
WS128K32-XH1X - 13 grams typical
WS128K32-XG4TX1 - 20 grams typical
Devices are upgradeable to 512Kx32
This product is subject to change without notice.
Access Times of 15, 17, 20, 25, 35, 45, 55ns
MIL-STD-883 Compliant Devices Available
Packaging
66 pin, PGA Type, 1.075" square, Hermetic
Ceramic HIP (Package 400)
68 lead, 40mm CQFP (G4T)1, 3.56mm (0.140")
(Package 502)
68 lead, 22.4mm CQFP (G2U), 3.56mm (0.140"),
(Package 510)
68 lead, 22.4mm (0.880") square, CQFP (G2L),
5.08mm (0.200") high, (Package 528)
Organized as 128Kx32; User Congurable as
256Kx16 or 512Kx8
Commercial, Industrial and Military Temperature
Ranges
5 Volt Power Supply
Pin Description
Top View
Block Diagram
FIGURE 1 – PIN CONFIGURATION FOR WS128K32N-XH1X
WE#1 CS#1
CS#2
CS#3
CS#4
WE#4
WE#3
WE#2
128K x 8
OE#
A0-16
I/O 0-7
I/O 24-31
I/O 16-23
I/O 8-15
88
8
I/O0-31
Data Inputs/Outputs
A0-16
Address Inputs
WE1-4#
Write Enables
CS1-4#
Chip Selects
OE#
Output Enable
VCC
Power Supply
GND
Ground
NC
Not Connected
FEATURES
I/O8
I/O9
I/O10
A13
A14
A15
A16
NC
I/O0
I/O1
I/O2
1
12
23
344556
11
22
33
44
55
66
WE2#
CS2#
GND
I/O11
A10
A11
A12
VCC
CS1#
NC
I/O3
I/O31
I/O30
I/O29
I/O28
A0
A1
A2
I/O23
I/O22
I/O21
I/O20
VCC
CS4#
WE4#
I/O27
A3
A4
A5
WE3#
CS3#
GND
I/O19
I/O24
I/O25
I/O26
A6
A7
NC
A8
A9
I/O16
I/O17
I/O18
I/O15
I/O14
I/O13
I/O12
OE#
NC
WE1#
I/O7
I/O6
I/O5
I/O4
相關(guān)PDF資料 |
PDF描述 |
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| WS128K32N-20H1M | 128K X 32 MULTI DEVICE SRAM MODULE, 20 ns, CPGA66 |
| WS128K32L-35G2UM | 128K X 32 MULTI DEVICE SRAM MODULE, 35 ns, CQFP68 |
| WS128K32N-20G2UCA | 128K X 32 MULTI DEVICE SRAM MODULE, 20 ns, CQFP68 |
| WS128K32N-35G2UC | 128K X 32 MULTI DEVICE SRAM MODULE, 35 ns, CQFP68 |
| WS128K32L-20G2UMA | 128K X 32 MULTI DEVICE SRAM MODULE, 20 ns, CQFP68 |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| WS128K32N-35G2TCE | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:128Kx32 SRAM MULTICHIP PACKAGE, RADIATION TOLLERANT |
| WS128K32N-35G2TCEA | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:128Kx32 SRAM MULTICHIP PACKAGE, RADIATION TOLLERANT |
| WS128K32N-35G2TIE | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:128Kx32 SRAM MULTICHIP PACKAGE, RADIATION TOLLERANT |
| WS128K32N-35G2TIEA | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:128Kx32 SRAM MULTICHIP PACKAGE, RADIATION TOLLERANT |
| WS128K32N-35G2TME | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:128Kx32 SRAM MULTICHIP PACKAGE, RADIATION TOLLERANT |
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