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參數(shù)資料
| 型號： | WS128K32-35 |
| 英文描述： | 128Kx32 SRAM Module(128Kx32靜態(tài)RAM模塊（存取時(shí)間35ns）) |
| 中文描述： | 128Kx32 SRAM的模塊（128Kx32靜態(tài)內(nèi)存模塊（存取時(shí)間為35ns）） |
| 文件頁數(shù)： | 1/9頁 |
| 文件大?。?/td> | 156K |
| 代理商： | WS128K32-35 |
1
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
HI-RELIABILITY PRODUCT
WS128K32-XXX
128Kx32 SRAM MODULE, SMD 5962-93187 & 5962-95595
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Commercial, Industrial and Military Temperature
Ranges
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5 Volt Power Supply
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Low Power CMOS
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TTL Compatible Inputs and Outputs
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Built in Decoupling Caps and Multiple Ground Pins for
Low Noise Operation
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Weight:
WS128K32-XG1UX - 5 grams typical
WS128K32-XG2TX - 8 grams typical
WS128K32-XH1X - 13 grams typical
WS128K32-XG4TX - 20 grams typical
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All devices are upgradeable to 512Kx32
FEATURES
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Access Times of 15, 17, 20, 25, 35, 45, 55ns
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MIL-STD-883 Compliant Devices Available
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Packaging
66 pin, PGA Type, 1.075" square, Hermetic Ceramic
HIP (Package 400)
68 lead, 40mm CQFP (G4T), 3.56mm (0.140")
(Package 502).
68 lead, 22.4mm CQFP (G2T), 4.57mm (0.180"),
(Package 509)
68 lead, 22.4mm Low Profile CQFP (G1U), 3.57mm
(0.140"), (Package 519)
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Organized as 128Kx32; User Configurable as 256Kx16
or 512Kx8
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Low Power Data Retention - only available in G2T
package type
PIN DESCRIPTION
I/O
0-31
Data Inputs/Outputs
A
0-16
Address Inputs
WE
1-4
Write Enables
CS
1-4
Chip Selects
OE
Output Enable
V
CC
Power Supply
GND
NC
Not Connected
Ground
I/O
8
I/O
9
I/O
10
A
13
A
14
A
15
A
16
NC
I/O
0
I/O
1
I/O
2
WE
2
CS
2
GND
I/O
11
A
10
A
11
A
12
V
CC
CS
1
NC
I/O
3
I/O
15
I/O
14
I/O
13
I/O
12
OE
NC
WE
1
I/O
7
I/O
6
I/O
5
I/O
4
I/O
24
I/O
25
I/O
26
A
6
A
7
NC
A
8
A
9
I/O
16
I/O
17
I/O
18
V
CC
CS
4
WE
4
I/O
27
A
3
A
4
A
5
WE
3
CS
3
GND
I/O
19
I/O
31
I/O
30
I/O
29
I/O
28
A
0
A
1
A
2
I/O
23
I/O
22
I/O
21
I/O
20
11 22 33 44 55 66
1 12 23 34 45 56
TOP VIEW
BLOCK DIAGRAM
128K x 8
8
I/O
0-7
CS
1
1
128K x 8
8
I/O
8-15
2
128K x 8
8
I/O
16-23
3
128K x 8
8
I/O
24-31
4
A
0-16
OE
WE
CS
2
WE
CS
3
WE
CS
4
WE
FIG. 1
PIN CONFIGURATION FOR WS128K32N-XH1X
January 2001 Rev. 7
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| WS128K32-45 | 128Kx32 SRAM Module(128Kx32靜態(tài)RAM模塊（存取時(shí)間45ns）) |
| WS128K32-55 | 128Kx32 SRAM Module(128Kx32靜態(tài)RAM模塊（存取時(shí)間55ns）) |
| WS128K32-25G2SMX | 128Kx32 Radiation Hardened SRAM Module(128Kx32抗輻射靜態(tài)RAM模塊) |
| WS128K32-XG2TXE | 128Kx32 SRAM Multichip Package, Radiation Tolerant(128Kx32靜態(tài)RAM允許輻射(多種封裝）) |
| WS128K32-XXX | 128Kx32 SRAM Module(低功耗CMOS，128Kx32靜態(tài)RAM模塊（存取時(shí)間15，17，20，25，35，45，55ns）) |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| WS128K32-35G2I | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:x32 SRAM Module |
| WS128K32-35G2LIA | 制造商:White Electronic Designs 功能描述:Res Thin Film 2010 374K Ohm 0.1% 1/4W ±10ppm/°C Molded SMD Plastic T/R 制造商:Microsemi Corporation 功能描述:MICROCIRCUIT, SRAM, 128K X 32 - Bulk |
| WS128K32-35G2M | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:x32 SRAM Module |
| WS128K32-35G2Q | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:x32 SRAM Module |
| WS128K32-35G2TC | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:x32 SRAM Module |
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