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參數(shù)資料
| 型號(hào)： | WEDPS512K32LV-15BC |
| 廠商： | WHITE ELECTRONIC DESIGNS CORP |
| 元件分類： | SRAM |
| 英文描述： | 512K X 32 MULTI DEVICE SRAM MODULE, 15 ns, PBGA143 |
| 封裝： | 16 X 18 MM, PLASTIC, BGA-143 |
| 文件頁(yè)數(shù)： | 7/7頁(yè) |
| 文件大?。?/td> | 268K |
| 代理商： | WEDPS512K32LV-15BC |
7
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
WEDPS512K32V-XBX
June 2004
Rev. 5
Document Title
512K x 32 SRAM PBGA Multi-Chip Package
Revision History
Rev #
History
Release Date
Status
Rev 0
Initial Release
March 2002
Advanced
Rev 1
Changes (Pg. 1)
1.1 Switch Rows and Columns header position
March 2002
Advanced
Rev 2
Changes (Pg. 1)
2.1 Switch Rows and Columns header position (Pg. 1)
May 2002
Advanced
Rev 3
Changes (Pg. 1, 5)
3.1 Remove excess white space from package drawing for to
create a consistent accurate style.
May 2002
Advanced
Rev 4
Changes (Pg. 1, 2, 7)
4.1 Add Thermal Resistance Table
4.2 Change product status to Final
January 2003
Final
Rev 5
Changes (Pg. 1, 2, 6, 7)
5.1 Add low power data retention option
June 2004
Final
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| WMS512K8-70FC | 512K X 8 STANDARD SRAM, 70 ns, CDFP36 |
| WF256K8-60CI5 | 256K X 8 FLASH 5V PROM MODULE, 60 ns, CDIP32 |
| WS128K32-17G4TIE | 512K X 8 MULTI DEVICE SRAM MODULE, 17 ns, CQFP68 |
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| WEDPS512K32LV-15BI | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:512Kx32 SRAM 3.3V MULTI-CHIP PACKAGE |
| WEDPS512K32LV-15BM | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:512Kx32 SRAM 3.3V MULTI-CHIP PACKAGE |
| WEDPS512K32LV-17BC | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:512Kx32 SRAM 3.3V MULTI-CHIP PACKAGE |
| WEDPS512K32LV-17BI | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:512Kx32 SRAM 3.3V MULTI-CHIP PACKAGE |
| WEDPS512K32LV-17BM | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:512Kx32 SRAM 3.3V MULTI-CHIP PACKAGE |
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